ARM9 based com

MXM-7110 Series Computer on Module (MXM-7110 and MXM-7114)

Introduction

This Chapter gives background information on the MXM-7110 series computer on module products from Embedian.

Section include：

• MXM computer on Module Family
• Comparison of MXM series Computer on Module Family
• Block diagram
• Snapshots

MXM-7110 Series ARM Based Computer on Module

MXM embedded ARM computer on modules are a small size, new concept, reliable, low power and powerful embedded ARM computers. MXM modules are widely used in Notebook graphic card. And Embedian is the world first to leverage this form factor into standard industrial design. Most importantly, all RISC-based modules will be pin-to-pin compatible from Embedian to save customers design efforts and extend their product lifetime.

It is designed to meet the needs for embedded networking and graphical systems, especially for mobile or stationary computer in automatic data collection field such as RFID terminals, batch/ wireless data collection terminals, wireless barcode scanner, POS terminals, thin clients, server PC, biometric access control terminals, transaction terminals, portable test instrument, advanced remote controller, and GPS systems for retail, light industrial and medical/pharmaceutical applications. With all drivers pre-installed for Linux 2.6.18.1 or Windows CE 5.0, people could easily develop their programs and make it time to market in very short time.

Based on Samsung ARM920T SoC plus Silicon Motion SM502 graphic enhanced (MXM-7114), the MXM-7110 series computer on module includes 64MB of NAND Flash, and 64MB of SDRAM. Additional interfaces include three to five RS-232 ports, two USB host ports, a Compact Flash controller that supports true IDE modes, 12 GPIOs, a real-time clock, an LCD controller supporting up to 1280 x 1024 displays and an audio codec.

A 242-pin golden finger connector enables the MXM -7110 series computer on module to interface with the OEM's custom circuitry, and with an evaluation carrier board that is supplied with Embedian's evaluation kit. The evaluation carrier board includes a LCD panel, headers and connectors for all interfaces.

MXM-7110 series computer on includes MXM-7110 and MXM-7114.

Comparison of MXM-7110 Series Computer on Module

MXM series computer on module families host a Samsung S3C2440A SOC (ARM920T core) clocking at 400Mhz with MMU and AMBA BUS.

There are two products (MXM-7110 and MXM-7114) so far in this product category. The differences between each model are listed in the following table 1.1. Users could decide the best features and choose the right model number.

Table 1.1

Note

1. (*) MXM-7114 = MXM-7110 + SM502 related functionality.
2. (**)128MB SDRAM is available by project based.
3. (***) The 60-pin 0.5mm pitch SMT board-to-board connector is all SM502 related signal. For MXM-7110, user doesn't need this connector. And for other manufacturers that would like to adopt this form factor, add this type of connector if you have companion chip other than CPUs.

The MXM-7110 series computer on module is designed in a 66mm x 50mm factor.

MXM-7110 Series Block Diagram

The following diagram illustrates the system organization of the MXM-7110 and MXM-7114. Arrows indicate direction of control and not necessarily signal flow.

Figure 1.1 MXM-7110 series SBC Block Diagram

Snapshots

Figure 1.2 Snapshot of MXM-7110 Series Computer on Module

Details for this diagram will be explained in the following chapters.

Specifications

This Chapter contains specifications of MXM-7110 series computer on module.

Section include：

• Functional specifications
• Mechanical specifications
• Electrical specifications
• Environmental specifications
• MTBF
• EMI/RFI and ESD protection

Functional Specification

Processor

• Samsung S3C2440A
• 32-bit ARM920T Core
• Clock Rates up to 400Mhz
• 133Mhz System BUS
• Voltage and Frequency Scaling
• Booting from NAND Flash

Power Supply

• Single input +5V DC power from 242-pin interface
• Real-time clock battery powered

Memory

• Onboard 64MB NAND Flash
• Onboard 64MB SDRAM (32-bit), 128MB SDRAM available on project based
• CompactFlash(CF), Type I and Type II, 3.3V, True IDE Mode

Universal Serial Bus (USB)

• Chipset: CPU internal
• Two USB 1.1 host ports (12Mbit/s speed)
• OHCI Rev. 1.0 Compliance
• USB Hub as model option
• USB legacy keyboard, mouse and hard disk support

COM Port

• Chipset: CPU internal and SM502
• Five RS232 ports, (three from CPU and two from SM502)
• Four with TX, RX, CTS and RTS. One with TX, RX only.

Ethernet

• Chipset：Davicom DM9000B
• One 10/100Mbps Ethernet (MAC integrated), RJ-45 connector onboard
• Compliance with IEEE 802.3u 100Base-TX and 802.3 10Base –T
• Compliance with IEEE 802.3u auto-negotiation protocol for automatic link-type selection
• Full-duplex/half -duplex capability
• Supports IEEE 802.3x full duplex flow control
• Support Auto-MDIX

CompactFlash(CF) Interface

• Chipset: CPU Memory Bus
• Type I and Type II, 3.3V
• True IDE mode

AC97 Audio-Codec Interface

• Chipset: CPU AC-link interface
• Support 16-bit Sample
• AC97 version 2.3 compliance interface
• 1-ch stereo PCM inputs/ 1-ch stereo PCM outputs1-ch MIC input
• Advanced Linux Sound Architecture (ALSA) API support

Discrete I/O

• 12 general-purpose digital I/Os
• 8 External interrupt to eliminate performance hogging polling

IIC Interface

• Chipset: CPU internal
• 1-ch Multi-Master IIC-Bus
• Serial, 8-bit oriented and bi-directional data transfers can be made at up to 100 Kbit/s in Standard mode or up to 400 Kbit/s in Fast mode.

SPI Interface

• Chipset: CPU internal
• Compatible with 2-ch Serial Peripheral Interface Protocol version 2.11
• 2x8 bits Shift register for Tx/Rx
• DMA-based or interrupt-based operation

Watchdog Timer (WDT)

• Chipset：CPU internal
• 16-bit Watchdog Timer
• Interrupt Request or System Reset at Timeout

CPU Video Graphic Array (VGA)

• Chipset：CPU internal
• TFT Panel Support
• 640 x 480 resolution for best performance
• 65,000 color support
• TTL and 18-bit interface

Pulse Width Modulation (PWM)

• Chipset：CPU Internal
• 4-ch 16-bit Timer with PWM / 1-ch 16-bit internal timer with DMA-based or interrupt-based operation
• Programmable duty cycle, frequency, and polarity

SM502 Video Graphic Array (VGA)

• Chipset：Silicon Motion SM502
• Single channel LVDS Panel Support
• 1280 x 1024 resolution
• 260,000 color support
• External 8MB SDRAM onboard
• 24-bit LVDS and CRT interface (18-bit available)

Touch Panel Interface

• Chipset：CPU Internal
• 10-bit CMOS ADC
• 4-wire SDC interface

CPU System Bus (ISA-like Interface)

• Chipset：CPU internal
• For add-on companion chip
• 16-bit only

Real Time Clock (RTC)

• RTC power interface

JTAG

• Male 2.54 mm 2x7 header

BIOS

• Universal Bootloader (u-boot)
• Serial or Ethernet TFTP download
• Booting from NAND Flash Technology

Operating System

• Linux 2.6.18.1 (Debian ARM Linux)
• Windows CE 5.0

Mechanical Specification

The MXM-7110 series embedded ARM computer boards is very tiny (66mm x 50mm) in form factor. This section describes the component dimensions and mounting of the board. Detailed drawings are available from Embedian for production customers.

Dimensions

Length x Width: 66mm x 50mm (2.60" x 1.97")

Mechanical Drawing

The following mechanical drawing specifies the dimension of MXM-7110 seriers computer on module, as well as key components on the board. All dimensions are in mini-meters.

Top View

Bottom View

Mounting Holes

Two mounting holes are provided for mounting. The diameter of the holes is 4.0 mm. (The diameter of the ring is 5.5mm.) Mounting holes are plated through and connected to the module ground plane.

For reliable ground connections, use locking washers (star or split) when securing an MXM-7110 series computer on module in a carrier board. Make sure that the washers do not extend beyond the limits of the pads provided (5.5mm). A M3, F head, 4mm long, 5mm in diameter, and 1mm head thick screw is recommended.

Clearances

The MXM-7110 series computer on module has a low profile. Key clearances are as follows:

Height on Top

Max 2.8 mm (110.24 mil)

Height on Bottom

Maximum 2.4 mm (94.49 mil)

Board Thickness

1.2 mm

Clearance over Top and Bottom

6.4 mm

Weight

About 20g

Electrical Specification

Supply Voltages

+5V DC power (+/- 5%)

MXM-7110 series computer on module require a +5V power supply from custom carrier board.

Supply Voltage Ripple

100mV peak to peak 0 - 20MHz

Supply Current (Typical)

MXM-7110 series computer on module is a low power consumption computer on module. The power-consumption tests were executed to give an overview of the electrical conditions for several operational states.

Following table lists the typical power consumption of each MXM-7110 series computer on module. All I/Os are up under the testing environment.

Table 2.1 Power Consumption of MXM-7110 series Computer on Module

Note:

1. The above data is module only and the tested LCD is 640x480 TFT panel.

Real-Time Clock (RTC) Battery

• Voltage range: 1.8V – 3.6V (Typical@3.0V)
• Quiescent current: max. 3uA@3.0 V

CF

• 3.3V only

LCD

The LCD signal control voltage specification is as follows.

• +3.3/5V for TTL level LCD Panel

Environmental Specification

Temperature

• Operating: -5^oC to +75^oC(*) (with appropriate airflow)
• Non-operating: -10^oC to +85^oC (non-condensing)

Note:

• (*) The maximum operating temperature is the maximum measurable temperature on any spot on the module's surface. You must maintain the temperature according to the above specification.

Humidity

• Operating: 0 to 95% (non-condensing)
• Non-operating: 0 to 95% (non-condensing)

MTBF

• System MTBF (hours) : >100,000 hours

The above MTBF (Mean Time Between Failure) values were calculated using a combination of manufacturer's test data, if the data was available, and a Bellcore calculation for the remaining parts. The Bellcore calculation used is "Method 1 Case 1". In that particular method the components are assumed to be operating at a 50 % stress level in a 40^o C ambient environment and the system is assumed to have not been burned in. Manufacturer's data has been used wherever possible. The manufacturer's data, when used, is specified at 50^oC, so in that sense the following results are slightly conservative. The MTBF values shown below are for a 40^oC in an office or telecommunications environment. Higher temperatures and other environmental stresses (extreme altitude, vibration, salt water exposure, etc.) lower MTBF values.

EMI/RFI and ESD Protection

The MXM-7110 series computer on module incorporates a number of standard features that protect it from electrostatic discharge (ESD) and suppress electromagnetic and radio-frequency interference (EMI/RFI). Transient voltage suppressors, EMI fences, filters on I/O lines and termination of high-frequency signals are included standard on all systems.

The module provides surge protection on the input power lines of itself. This is especially important if the power supply wires will be subject to EMI/RFI or ESD. If the system incorporates other external boards, it is the responsibility of the designer or integrator to provide surge protection on the system input power lines.

Hardware Reference

This section gives details of the hardware pin out assignment of the MXM-7110 series computer on module.

Connector Type

The MXM-7110 series computer on module uses MXM 242-pin golden finder as interface. The connector on module is called header and the connector on custom board is called socket.

Figure 3.1 CN2 Socket connector Type (Mating Connector: B33P102-0013 (Speed Tech), AS0B326-S78N-7F (Foxconn) or compatible)

Figure 3.2 CN3 Header Type (On module, Connector : DF12(3.0)-60DP-0.5V (**) (Hirose) or compatible)

Figure 3.3 CN3 Socket Type (On carrier board, Mating Connector : DF12-S27A-060 or compatible(Please contact Embedian for this part.))

Connector Mechanical Drawing

The detail connector mechanical drawing is as follows.

Figure 3.4 CN2 Socket Connector Mechanical Drawing

Figure 3.5 CN3 Header Connector Mechanical Drawing

Figure 3.6 CN3 Socket Connector Mechanical Drawing

Connector Location

MXM series computer on module use 242-pin MXM form factor golden finger connectors CN2 and a 60-pin DF12(3.0)-60DP-0.5V (**) (Hirose) or compatible connector CN3 (MXM-7114 only) as an interface to connect with carrier board. The CN3 is mainly for SM502 related. For other manufactures that are intend to use the MXM form factor, please add your companion chip pin out to CN3 as well.

Figure 3.7 Connector Location I

Figure 3.8 Connector Location II

Connector Pin Assignments

The following tables describe the electrical signals available on the connectors of the MXM-7110 series computer on module. Each section provides relevant details about the connector including part numbers, mating connectors, signal descriptions and references to related chapters. For precision measurements of the location of the connectors on the module, refer to section 2.2.2. for mechanical drawing.

Legend:

Signal Types:

CN2 Connector (Golden Finger)

Address bus, data bus, CompactFlash, IDE, JTAG, Ethernet, chip select signal, external interrupt signals and all other CPU related are from CN2.

The following table shows the pin outs of CN2 connector.

Table 3.1 CN2 Connector (Bottom Side)

Table 3.1	CN2 Connector (Bottom Side)
Description	Mating Connector : B33P102-0013 (Speed Tech), AS0B326-S78N-7F (Foxconn) or compatible
Header	Pin	Signal Name	Function	Type
	4-wire touch screen
1	XP	Plus X-axis on-off control signal	AI
3	XM	Minus X-axis on-off control signal	AI
5	YP	Plus Y-axis on-off control signal	AI
7	YM	Minus Y-axis on-off control signal	AI
ADC Input
9	AIN3	ADC Input	AI
11	AIN2	ADC Input	AI
13	AIN1	ADC Input	AI
15	AIN0	ADC Input	AI
Reserved Pin
17	RSVD	Reserved	NC
19	RSVD	Reserved	NC
21	RSVD	Reserved	NC
23	RSVD	Reserved	NC
Key
Key
Key
Key
Key
Key
37	RSVD	Reserved	NC
39	RSVD	Reserved	NC
DMA
41	DMAACK0	External DMA acknowledge	O
43	DMADREQ0	External DMA request	I
Address Bus
45	ADDR0	Address Bus	O
47	ADDR1	O
49	ADDR2	O
51	ADDR3	O
53	ADDR4	O
55	ADDR5	O
57	ADDR6	O
59	ADDR7	O
61	ADDR8	O
63	ADDR9	O
65	ADDR10	O
67	ADDR11	O
69	ADDR12	O
71	ADDR13	O
73	ADDR14	O
75	ADDR15	O
77	GND	Ground Power	P
Address Bus
79	ADDR16	Address Bus	O
81	ADDR17	O
83	ADDR18	O
85	ADDR19	O
87	ADDR20	O
89	ADDR21	O
91	ADDR22	O
93	ADDR23	O
95	ADDR24	O
97	ADDR25	O
99	ADDR26	O
Reserved Pin
101	RSVD	Reserved	NC
103	RSVD	Reserved	NC
105	RSVD	Reserved	NC
107	RSVD	Reserved	NC
109	RSVD	Reserved	NC
111	RSVD	Reserved	NC
113	RSVD	Reserved	NC
115	GND	Ground	P
Chip Select
117	nGCS0	Chip Select	O
119	nGCS1	O
121	nGCS2	O
123	nGCS3	O
125	nGCS4	O
127	nGCS5	O
129	nWBE0	Write byte enable	O
131	nWBE1	O
133	nOE	Output Enable	O
135	nWE	Write Enable	O
Data Bus
137	DATA0	DATA[15:0] INPUT DATA DURING MEMORY READ AND OUTPUT DATA DURING MEMORY WRITE. BUS WIDTH OF 8/16 BIT IS PROGRAMMABLE	I/O
139	DATA1	I/O
141	DATA2	I/O
143	DATA3	I/O
145	DATA4	I/O
147	DATA5	I/O
149	DATA6	I/O
151	DATA7	I/O
153	DATA8	I/O
155	DATA9	I/O
157	DATA10	I/O
159	DATA11	I/O
161	DATA12	I/O
163	DATA13	I/O
165	DATA14	I/O
167	DATA15	I/O
169	nWAIT	nWAIT requests	I
171	CLKOUT	Clock Output	O
173	WAKEUP	Wakeup requests	I
175	nRESET_IN	Reset S3C2440A	ST
177	nRESET_OUT	Reset External Device	O
179	OM0	BootRom Select	I
Reserved Pin
181	RSVD	Reserved	NC
183	RSVD	NC
USB Host 1
185	USBH-	USB Host Data -	I/O
187	USBH+	USB Host Data +	I/O
Reserved Pin
189	RSVD	Reserved	NC
191	RSVD	NC
USB Host 2
193	USBH-	USB Host Data -	I/O
195	USBH+	USB Host Data +	I/O
197	GND	Ground Power	P
Reserved Pin
199	RSVD	Reserved	NC
201	RSVD	NC
203	RSVD	NC
205	RSVD	NC
207	RSVD	NC
209	RSVD	NC
211	RSVD	NC
213	RSVD	NC
215	RSVD	NC
217	RSVD	NC
219	RSVD	NC
221	RSVD	NC
223	RSVD	NC
225	RSVD	NC
227	RSVD	NC
229	RSVD	NC
231	RSVD	NC
233	RSVD	NC
235	RSVD	NC
237	RSVD	NC
239	RSVD	NC
241	RSVD	NC

Table 3.2 CN2 Connector (Top Side)

Table 3.2	CN2 Connector (Top Side)
Description	Mating Connector : B33P102-0013 (Speed Tech), AS0B326-S78N-7F (Foxconn) or compatible
Header	Pin	Signal Name	Function	Type
	Reserved Pin
2	RSVD	Reserved	NC
4	RSVD	NC
JTAG
6	TMS	TAP Controller Mode Select	I
8	TDO	TAP Controller Data Output	O
10	TDI	TAP Controller Data Input	I
12	TCK	TAP Controller Clock	I
14	nTRST	TAP Controller Reset	I
AC97
16	AC_SYNC	48kHz fixed rate sample sync	O
18	AC_BIT_CLK	12.288MHz serial data clock	IO
20	AC_nRESET	AC’97 Master H/W Reset	O
22	AC_SDATA_IN	AC'97 input stream	I
24	AC_SDATA_OUT	AC'97 output stream	O
Key
Key
Key
Key
Key
Key
Power Input
38	EXT5V	DC in 5V	P
40	EXT5V	DC in 5V	P
42	EXT5V	DC in 5V	P
44	EXT5V	DC in 5V	P
Reserved
46	RSVD	Reserved	NC
CPU LCD
48	VD19	LCD data bus RED0 (LSB)	O
50	VD20	LCD data bus RED1	O
52	VD21	LCD data bus RED2	O
54	VD22	LCD data bus RED3	O
56	VD23	LCD data bus RED4 (MSB)	O
58	VD10	LCD data bus GREEN0 (LSB)	O
60	VD11	LCD data bus GREEN1	O
62	VD12	LCD data bus GREEN2	O
64	VD13	LCD data bus GREEN3	O
66	VD14	LCD data bus GREEN4	O
68	VD15	LCD data bus GREEN5 (MSB)	O
Reserved Pin
70	RSVD	Reserved	O
72	VD3	LCD data bus BLUE0 (LSB)	O
74	VD4	LCD data bus BLUE1	O
76	VD5	LCD data bus BLUE2	O
78	VD6	LCD data bus BLUE3	O
80	VD7	LCD data bus BLUE4 (MSB)	O
82	VCLK	LCD clock signal	O
84	HSYNC	Horizontal synchronous signal	O
86	VSYNC	Vertical synchronous signal	O
88	VDEN	Data enable signal	O
90	GND	Grpund Power	P
PWM
92	PWM0	Pulse Width Modulation Output	O
94	PWM1	O
96	PWM2	O
98	PWM3	O
IIC
100	IICSCL	IIC-bus clock	IO
102	IICSDA	IIC-bus data	IO
SPI
104	SPIMISO0	Master mode: data input; Slave mode: data output	IO
106	SPIMOSI0	Master mode: data output; Slave mode: data input	IO
108	SPICLK0	SPI Clock	IO
110	nSS0	SPI Chip Select	I
112	SPIMISO1	Master mode: data input; Slave mode: data output	IO
114	SPIMOSI1	Master mode: data output; Slave mode: data input	IO
116	SPICLK1	SPI Clock	IO
118	nSS1	SPI Chip Select	I
Interrupt
120	EXT_INT1	External interrupt request	I
122	EXT_INT2	I
124	EXT_INT3	I
126	EXT_INT4	I
128	EXT_INT5	I
130	EXT_INT6	I
132	EXT_INT7	I
134	EXT_INT8	I
136	GND	Ground Power	I
GPIOs
138	GPIO1	General input/output ports	IO
140	GPIO2	IO
142	GPIO3	IO
144	GPIO4	IO
146	GPIO5	IO
148	GPIO6	IO
150	GPIO7	IO
152	GPIO8	IO
154	GPIO9	IO
156	GPIO10	IO
158	GPIO11	IO
160	GPIO12	IO
162	VCCIO_PWREN	External Device Power Control	O
164	VCCLCD_PWREN	Panel Power Control	O
166	BACKLIGHT_EN	Panel Backlight Control	O
168	LCD_PWREN	Panel Signal Control	O
170	BBAT	RTC Battery Power(DC 3V)	P
SD Card(*)
172	SD_nCD	SD Insert Detect	I
174	SD_WP	SD Write Protect	I
176	SDCLK	SD Clock	O
178	SDCMD	SD receive response/ transmit command	O
180	SDDAT0	SD receive/transmit data	IO
182	SDDAT1	SD receive/transmit data	IO
184	SDDAT2	SD receive/transmit data	IO
186	SDDAT3	SD receive/transmit data	IO
188	GND	Ground Power	P
Reserved Pin
190	RSVD	Reserved	NC
192	RSVD	NC
194	RSVD	NC
196	RSVD	NC
198	RSVD	NC
200	RSVD	NC
202	RSVD	NC
204	RSVD	NC
UART
206	RXD2	UART receives data input	I
208	TXD2	UART transmits data output	O
210	nCTS1	UART clear to send input signal	I
212	nRTS1	UART request to send output signal	O
214	RXD1	UART receives data input	I
216	TXD1	UART transmits data output	O
218	nCTS0	UART clear to send input signal	I
220	nRTS0	UART request to send output signal	O
222	RXD0	UART receives data input	I
224	TXD0	UART transmits data output	O
Ethernet
226	LANLED1	Ethernet Speed LED	O
228	LANLED2	Ethernet Link LED	O
230	AVDD18	1.8V For Transformer	P
232	TX-	Ethernet Transmits data-	O
234	TX+	Ethernet Transmits data+	O
236	AGND	Ethernet Ground	P
238	RX-	Ethernet Receives data-	I
240	RX+	Ethernet Receives data+	I
242	AVDD18	1.8V For Transformer	P

(*)As of now, Linux driver is not supported.

CN3 Connector (MXM-7114 Only)

All SM502 related interface is from CN3.

The following table shows the pin outs of CN3 connector.

Table 3.3 CN3 Connector

Table 3.3	CN3 Connector
Description	Connector: DF12(3.0)-60DP-0.5V (**) (Hirose) or compatible Mating Connector : DF12-S27A-060. Please Contact Embedian for this Part.
Header	Pin	Signal Name	Function	Type
	2	SM502_VCLK	LCD clock signal	O
4	SM502_HSYNC	Horizontal synchronous signal	O
6	SM502_VSYNC	Vertical synchronous signal	O
8	SM502_VDEN	Data enable signal	O
10	SM502_LCDPWREN	Panel Signal Control	O
12	GND	Ground Power	P
14	SM502_VGA_B	VGA Blue output	AO
16	SM502_VGA_G	VGA Green output	AO
18	SM502_VGA_R	VGA Red output	AO
20	SM502_VGA_HSYNC	VGA Horizontal synchronous signal	O
22	SM502_VGA_VSYNC	VGA Vertical synchronous signal	O
24	GND	Ground Power	P
26	GND	Ground Power	P
ZV Port(**)
28	VP_VSYNC	Video Port Vertical synchronous signal	I
30	VP_HREF	Video Port Horizontal synchronous signal	I
32	VP_CLK	Video Port clock signal	I
34	ZV0	Video Data Input	I
36	ZV1	I
38	ZV2	I
40	ZV3	I
42	ZV4	I
44	ZV5	I
46	ZV6	I
48	ZV7	I
50	RSVD	Reserved	NC
SM502 UART0
52	SM502_TXD0	UART transmits data output	O
54	SM502_RXD0	UART receives data input	I
56	SM502_nCTS0	UART clear to send input signal	I
58	SM502_nRTS0	UART request to send output signal	O
Power Input
60	EXT5V	DC5V Input	P
SM502 LCD Data Bus
1	SM502_LCDDATA0	LCD data bus BLUE0 (LSB)	O
3	SM502_LCDDATA1	LCD data bus BLUE1	O
5	SM502_LCDDATA2	LCD data bus BLUE2	O
7	SM502_LCDDATA3	LCD data bus BLUE3	O
9	SM502_LCDDATA4	LCD data bus BLUE4	O
11	SM502_LCDDATA5	LCD data bus BLUE5	O
13	SM502_LCDDATA6	LCD data bus BLUE6	O
15	SM502_LCDDATA7	LCD data bus BLUE7 (MSB)	O
17	SM502_LCDDATA8	LCD data bus GREEN0 (LSB)	O
19	SM502_LCDDATA9	LCD data bus GREEN1	O
21	SM502_LCDDATA10	LCD data bus GREEN2	O
23	SM502_LCDDATA11	LCD data bus GREEN3	O
25	SM502_LCDDATA12	LCD data bus GREEN4	O
27	SM502_LCDDATA13	LCD data bus GREEN5	O
29	SM502_LCDDATA14	LCD data bus GREEN6	O
31	SM502_LCDDATA15	LCD data bus GREEN7(MSB)	O
33	SM502_LCDDATA16	LCD data bus RED0 (LSB)	O
35	SM502_LCDDATA17	LCD data bus RED1	O
37	SM502_LCDDATA18	LCD data bus RED2	O
39	SM502_LCDDATA19	LCD data bus RED3	O
41	SM502_LCDDATA20	LCD data bus RED4	O
43	SM502_LCDDATA21	LCD data bus RED5	O
45	SM502_LCDDATA22	LCD data bus RED6	O
47	SM502_LCDDATA23	LCD data bus RED7 (MSB)	O
49	RSVD	Reserved	NC
SM502 UART1
51	SM502_TXD1	UART transmits data output	O
53	SM502_RXD1	UART receives data input	I
55	SM502_nCTS1	UART clear to send input signal	I
57	SM502_nRTS1	UART request to send output signal	O
Power Input
59	EXT5V	DC5V Input	P

(**)As of now, no driver support yet.

Firmware Architecture

The firmware means the software that stores in NAND flash. MXM-7110 series computer on module support boot from NAND flash directly. However, the evaluation kit has a NOR flash to help user restore the firmware in NAND flash. People can refer to Dual BIOS Design section for more details.

For Linux, the firmware in NAND includes u-boot, sysconfig, kernel zImage and rescue root filesystems (initrd). And for Windows CE, the firmwares in NAND includes u-boot and NK.nb0.

This chapter explains the firmware architecture of NAND flash for both opearting sytem and how to update them.

Firmware for Linux

Figure 4.1 shows the firmware architecture of Linux in NAND.

Figure 4.1 Firmware Architecture of Linux in NAND Flash

The u-boot starts from the 0th block.(0x0, 1 block = 16K). The Linux kernel zImage starts from the 12th block. (0xc) The sysconfig stores the system configuruation like IP address, default drivers to be load, default services,,,,.etc. and starts from the 128th block. (0x80) The rescue file system is a small file system for rescue purposed and load the minimum set drivers and starts from the 256th block. (0x100) There are about 44MB unsed in NAND for users.

Users need a CF card or hard drive with root file system installed to boot up the complete system. (Users can also build his own smaller root filesystems.) The will be described at Backup and Restore Root File Systems section.

Users can update the firmware under u-boot or Linux root filesystems. The Embedian factory default is fimware pre-installed. Unless necessary, Embedian doesn't recommend you update firmware since the system might not boot anymore if you did wrong operation. (If you develop your own u-boot and kernel, you will need to do that.) There are two ways to update firmware. Following tells howto.

Update firmware under u-boot

You can update firmware under u-boot command prompt using Ethernet tftp download. Please be careful expecially when update u-boot itself or the system might not boot anymore. In case that the u-boot is gone, please go to next chapter and use NOR boot to restore the u-boot.

Before doing that, you need a tftp server program (there are many open source tftp server that you can use.) and install the tftp server under your Windows or Linux host PC. Please put the uboot.bin, zImage.dat, sysconfig.img and nand.img files (they are file name of u-boot, kernel zImage, sysconfig and initrd respectyively.) under tftp root directory.

Then go to u-boot command prompt. To do that, press any key when booting.

We recommend you erase the firmware in NAND first.

# nande 0xc 0x2000000

This will erase the firmware in NAND except u-boot.

If you want to erase all firmwares including of u-boot, you can

# nande 0x0 0x2000000

Now you have erase the u-boot, kernel zImage, sysconfig and initrd.

Next, ou need set up the IP address of your tftp server and device first.

# setenv ipaddr xxx.xxx.xxx.xxx

# setenv serverip xxx.xxx.xxx.xxx

# saveenv

For Example:

ipaddr 192.168.1.2

serverip 192.168.1.121

Note:

• Make sure that the ipaddr for device and serverip for Windows (or Linux) PC are in the same network domain.

Next, you can update the uboot.bin, zImage.dat, sysconfig.img and nand.img.

# tftp 30000000 uboot.bin

# nandw 0x0 0x1c000 30000000

# tftp 30000000 zImage.dat

# nandw 0xc 0x190000 30000000

# tftp 30000000 sysconfig.img

# nandw 0x80 0x200000 30000000

# tftp 30000000 nand.img

# nandw 0x100 0x1000000 30000000

Reboot, and now you have your firmware update.

Update firmware under Linux root file systems

You can also use Linux "dd" command at root file system. You need a CF card or hard drive with root file system installed and plug into devices. Copy the u-boot.bin, zImage and initrd.img (They are the file name of u-boot, kernel zImage and initrd.) into / directory. (You can ftp the files to devices.)

[root@apc7110 /]# cd /

[root@apc7110 /]# dd if=/u-boot.bin of=/dev/mtdblock/0

[root@apc7110 /]# dd if=/zImage of=/dev/mtdblock/2

[root@apc7110 /]# dd if=/initrd.img of=/dev/mtdblock/4

Reboot, and you have firmwares update.

Firmware for Windows CE 5.0

Figure 4.2 Firmware Architecture in NAND for Windows CE

Most Windows CE device using eboot as bootloader. Embedian uses u-boot still since u-boot is moch more powerful than eboot.

There are only two files (u-boot and Nk.nb0) in NAND flash. The u-boot starts from the 0th block.(0x0, 1 block = 16K). The NK.nb0 starts from the 12th block. (0xc) There are about 32MB unsed in NAND for users.

Users can update the firmware under u-boot. The Embedian factory default is fimware pre-installed. Unless necessary, Embedian doesn't recommend you update firmware since the system might not boot anymore if you did wrong operation. (If you develop your own u-boot and Nk.nb0, you will need to do that.) Following tells you how to update firmware under Windows CE system.

Update firmware under u-boot

You can update firmware under u-boot command prompt using Ethernet tftp download. Please be careful expecially when update u-boot itself or the system might not boot anymore. In case that the u-boot is gone, please go to next chapter and use NOR boot to restore the u-boot.

Before doing that, you need a tftp server program (there are many open source tftp server that you can use.) and install the tftp server under your Windows or Linux host PC. Please put the uboot.bin, zImage.dat, sysconfig.img and nand.img files (they are file name of u-boot, kernel zImage, sysconfig and initrd respectyively.) under tftp root directory.

Then go to u-boot command prompt. To do that, press any key when booting.

We recommend you erase the firmware in NAND first.

# nande 0xc 0x2000000

This will erase the firmware in NAND except u-boot.

If you want to erase all firmwares including of u-boot, you can

# nande 0x0 0x2000000

Now you have erase the u-boot, kernel zImage, sysconfig and initrd.

Next, ou need set up the IP address of your tftp server and device first.

# setenv ipaddr xxx.xxx.xxx.xxx

# setenv serverip xxx.xxx.xxx.xxx

# saveenv

For Example:

ipaddr 192.168.1.2

serverip 192.168.1.121

Note:

• Make sure that the ipaddr for device and serverip for Windows (or Linux) PC are in the same network domain.

Next, you can update the uboot.bin, Nk.nb0.

# tftp 30000000 uboot.bin

# nandw 0x0 0x1c000 30000000

# tftp 30000000 Nk.nb0

# nandw 0xc 0x2000000 30000000

Reboot, and you have your firmware update.

General PCB Design Recommendations

This section gives general description of the design recommendation of the Printed Circuit Board (PCB) for MXM-7110 series computer on module carrier boards. From a cost- effectiveness point of view, a four-layer board is the target platform for the carrier board design. For better quality, a six-layer or eight-layer board is preferred.

Nominal Board Stack Ups

The trace impedance typically noted (55 Ω ± 10%) is the "nominal" trace impedance for a 5-mil wide external trace and a 4-mil wide internal trace. However, some stackups may lead to narrower or wider traces on internal or external layers in order to meet the 55-Ω impedance target, that is, the impedance of the trace when not subjected to the fields created by changing current in neighboring traces. Note the trace impedance target assumes that the trace is not subjected to the EMI fields created by changing current in neighboring traces.

It is important to consider the minimum and maximum impedance of a trace based on the switching of neighboring traces when calculating flight times. Using wider spaces between the traces can minimize this trace-to-trace coupling. In addition, these wider spaces reduce settling time. Coupling between two traces is a function of the coupled length, the distance separating the traces, the signal edge rate, and the degree of mutual capacitance and inductance. In order to minimize the effects of trace-to-trace coupling, the routing guidelines documented in this Section should be followed. Also, all high speed, impedance controlled signals should have continuous GND referenced planes and cannot be routed over or under power/GND plane splits.

Four Layer Board Stackup

Figure 5-1 illustrates an example of a four-layer stack-up with 2 signal layers and 2 power planes. The two power planes are the power layer and the ground layer. The layer sequence of component-ground-power-solder is the most common stack-up arrangement from top to bottom.

Figure 5.1 Four-Layer Stack-Up

Table 5.1 Recommended Four-Layer Stack-Up Dimensions

Note:

Target PCB Thickness totals 62mil+/-10%

Six Layer Board Stack Up

Figure 5-2 illustrates an example of a six-layer stack-up with 4 signal layers and 2 power planes.

The two power planes are the power layer and the ground layer. The layer sequence of component-ground-IN1-IN2-power-solder is the most common stack-up arrangement from top to bottom.

Figure 5.2 Six-Layer Stack-Up

Table 5.2 Recommended Six-Layer Stack-Up Dimensions

Note:

Target PCB Thickness totals 62mil+/-10%

Differential Impedance Targets for Microstrip Routing

Table 5.3 shows the target impedance of the differential signals. The carrier board should follow the required impedance in this table.

Table 5.3 Differential Signals Impedance Requirement

Alternative Stack Ups

When customers choose to use different stack-ups (number of layers, thickness, trace width, etc.), the following key elements should be observed:

1. Final post lamination, post etching, and post plating dimensions should be used for electrical model extractions.
2. All high-speed signals should reference solid ground planes through the length of their routing and should not cross plane splits. To guarantee this, both planes surrounding strip-lines should be GND.
3. Recommend that high-speed signal routing be done on internal, strip-line layers. High-speed routing on external layers should be minimized in order to avoid EMI. Routing on external layers also introduces different delays compared to internal layers. This makes it extremely difficult to do length matching if routing is done on both internal and external layers.

Carrier Board Design Guidelines

This section gives detail description of the design recommendation of the MXM-7110 series computer on module carrier boards. It points out the rules that need to be carefully followed in circuit design and layout.

General Circuit Design Guide

This section states the circuit design guide. Please follow carefully or the system might not able to boot.

System-Wise

Please contact Embedian for this part.

Universal Serial BUS (USB)

MXM-7110 series computer modules provide two USB 1.1 ports.

Universal Serial Bus (USB)

The Universal Serial Bus (USB) provides a bi-directional, isochronous, hot-attachable Plug and Play serial interface for adding external peripheral devices such as game controllers, communication devices and input devices on a single bus.

USB stands for Universal Serial Bus, an industry-standard specification for attaching peripherals to a computer. It delivers high performance, the ability to plug in and unplug devices while the computer is running, great expandability, and a wide variety of solutions.

Signal Description

Table 6.1 shows MXM-7110 series computer on module USB signals, including pin number, signals, I/0 and descriptions.

Table 6.1 Differential Signals Impedance Requirement

Design Guidelines

Figure 6-1 shows USB connections for MXM-7110 series module USB signals.

Figure 6.1 USB Connection

Low ESR Capacitor

You can hot plug USB devices. In fact, this is one of the virtues of USB relative to most other legacy interfaces. The design of the USB power-decoupling network must absorb the momentary current surge from hot plugging an unpowered device.

Reducing these values is not recommended. These capacitors should be low ESR, low inductance.

ESD or EMI suppression components

The following guidelines apply to the selection and placement of common mode chokes and ESD protection devices. Some USB designs will need additional ESD or EMI suppression components on the USB data lines. These are most effective when they are placed near the external USB connector and grounded to a low-impedance ground plane. MXM-7110 series modules equips with two USB ports. Some people implement three or four ports. If the application needs more than two USB ports, a low cost USB hub IC can be integrated onto the carrier board and connected to the USB0 or USB1 ports on the MXM-7110 series module. This provides a larger number of USB ports.

A design may include a RC filter to provide a stuffing option in the event the filter is needed to pass EMI testing. Figure 6-2 shows the schematic of a typical RC filter and ESD suppression components. The RC filter should be placed as close as possible to the USB connector signal pins.

Figure 6.2 RC filter

Note:

ESD protection and RC filter are only needed if the design does not pass EMI or ESD testing. Basically, it is recommended to add them in the USB 1.1 interface. Footprints for ESD suppression components should be included in the event that a problem occurs (General routing and placement guidelines should be followed).

Layout Guidelines

Differential Pairs

The USB data pairs (ex. USB0H+ and USB0H-) should be routed on the carrier board as differential pairs, with a differential impedance of 90 Ω. PCB layout software usually allows determining the correct trace width and spacing to achieve this impedance, after the PCB stack-up configuration is known.

As per usual differential pair routing practices, the two traces of each USB pair should be matched in length and kept at uniform spacing. Sharp corners should be avoided. At the MXM module and connector ends of the routes, loop areas should be minimized. USB data pairs should be routed as far from other signals as possible.

Figure 6.3 USB Layout Guidelines

Cross a plane split

The mistake shown here is where the data lines cross a plane split. This causes unpredictable return path currents and would likely cause a signal quality failure as well as creating EMI problems.

Figure 6.4 Violations of Proper Routing Techniques

Stubs

A very common routing mistake is shown in Figure 6-5. Here the designer could have avoided creating unnecessary stubs by proper placement of the pull down resistors over the path of the data traces. Once again, if a stub is unavoidable in the design, no stub should be greater than 200 mils. Here is another example where a stub is created that could have been avoided. Stubs typically cause degradation of signal quality and can also affect EMI.

Figure 6.5 Creating unnecessary stubs

AC-Link Interface

MXM-7110 series module provides an AC Link interface which is compliant to AC97 Rev. 2.3 Specification. Please establish the AC97 CODEC on the carrier board for your application.

Signal Description

Table 6.2 shows MXM-7110 series module AC-Link signals, including pin number, signals, I/O and descriptions.

Table 6.2 Audio Signal Description

Design Guidelines

Figure 6-6 shows the connections for MXM module AC link signals. AC_BITC_LK is a 12.288 MHz clock driven by a crystal to the MXM module digital controller and to the codec.

Figure 6.6 AC-Link Connections