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NXP i.MX8 2 x 1.6GHz Cortex-A72 Core and 4 x 1.2GHz Cortex-A53
Real-time 2 x ARM Cortex-M4F
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2 x Vivante GC7000XSVX high performance GPU
Supports OpenGL ES 3.2, OpenVX 1.01, OpenCL 2.0 and OpenVG 1.1
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4k h.265 Decode, 1080p h.264 encodeXP i.MX9352 2 x 1.7GHz Cortex-A55 Core
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32-bit 4GB/8GB LPDDR4 up to 3200MT/s
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HDMI 2.0a with HDCP 2.2 and DP 1.3
Dual Channel LVDS display (up to 1920x1080@60Hz)
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1 x 2-lane and 1 x 4-lane MIPI-CS
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1 x 4-bit SDIO card interface with support lines
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| Two SPI interfaces with two chip selects per SPI channel. |
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Typically used for connection to I2S audio CODECs
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Lane configuration: 1 x PCIe x2 or 2 x PCIe x1
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Four asynchronous serial ports
Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).
Two ports supporting data-only signals (RXD, TXD).
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Logic level signals from Module based FlexCAN bus protocol controllers
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One USB OTG 2.0 Ports with PHY
Four USB 2.0 Host with PHY
One USB 3.0 Host with PHY
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Qualcomm AR8035 PHY on module
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| External Seiko S35390A controller on module |
| 12 x GPIO Signals, specific alternate functions are assigned to some GPIOs
PWM / Tachometer capability
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System and Power Management Signals |
Module Power State Status
Battery and Battery Charger Management Pins
Carrier Power On Control Pins
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| Three pins to allow selection from carrier board. Select options include to boot from one of the following:
Module eMMC Flash (Default)
Carrier SD Card (Recovery)
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| Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply |
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Industrial Temperature Range | -40 degree C ~ 85 degree C |
Commercial Temperature Range | |
Storage Temperature Range | -40 degree C ~ 150 degree C |
Junction Temperature Range | -40 degree C ~ 150 degree C |
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| 82 mm x 50 mm by SMARC 2.0 Specification |