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SMARC-iMX93

Prisintervall: $100 till $140


  • NXP i.MX93, 2 × Cortex-A55 @ 1,7 GHz
  • 1 GB / 2 GB LPDDR4, 16 GB eMMC
  • AI/ML Neuralt bearbetningsenhet (NPU)
  • LVDS, MIPI-DSI, 1 × 2-LANE MIPI-CSI och 2 × Gigabit Ethernet (GbE)
  • 2 × CAN-FD, 4 × UART, 4 × I2C, 2 × I2S, 2 × SPI, 1 × USB 2.0 OTG och 4 × USB 2.0

 

or
SKU: SMARC-iMX93-1G Category: Tag:

Dela:

SMARC-iMX93 NXP SMARC 2.2 System-on-Module


  • Dubbelkärnig ARM Cortex-A55 CPU, 1,7 GHz
  • Integrerad AI/ML Neural Processing Unit
  • Realtids ARM Cortex-M33 medprocessor
  • SMARC 2.2-kompatibel (82 mm x 50 mm)
  • Tillgänglighet garanterad till 2038

Översikt

SMARC-iMX93 är NXP:s senaste SMARC 2.2 systemmodul, utformad för inbyggda system och AI-applikationer. Den kombinerar en högpresterande processor, en neural accelerator och en realtidsmedprocessor, och är idealisk för industriell automatisering, edge computing och IoT-lösningar.


Höjdpunkter


1 GB eller 2 GB LPDDR4-minne och 16 GB eMMC-lagring


24-bitars enkelkanal LVDS, MIPI-DSI och 2-LANE MIPI-CSI


Certifierad 802.11a/b/g/n/ac/ax + Bluetooth 5.3-modul (valfri)


2 x Gigabit Ethernet (varav en med TSN), 1 x USB OTG, 4 x USB 2.0, 1 x SDIO, 2 x CAN-FD, 4 x UART, 4 x I2C, 2 x I2S, 2 x SPI, 12 x GPIO


Brett temperaturområde: -40°C till 85°C


Yocto Project, Debian, Linux och RTOS


Fullständigt Board Support Package (BSP) och färdiga bilder att köra


Yocto Project och Debian BSP (Board Support Package)


Kontinuerliga BSP-uppdateringar och underhåll


Snabba upp din produktdesign


Fullständigt designpaket för bärare: scheman, komponentlista (BOM), PCB-layout och 3D STEP-filer


Direkt teknisk support från Embedians designingenjörer


Gratis designgranskning av Embedians ingenjörer


Felsökning av bärare utförd av Embedians designingenjörer


Drivaranpassning för anpassade LCD-paneler

hardware document Specifikationer

Specifications

Technical Information

Compliance

SMARC 2.2 Compliant

Dimension (W x L)

82mm x 50mm

CPU



NXP i.MX9352 2 x 1.7GHz Cortex-A55 Core


Real-time 250Mhz ARM Cortex-M33


ARM Ethos-U65 microNPU (ML) 0.5 TOPs


PxP 2D GPU

Main Memory



16-bit 1GB/2GB LPDDR4x up to 3200MT/s


16GB eMMC (5.x) onboard


AT24C32 EEPROM onboard

Display


Single Channel LVDS display (up to 1366x768@60Hz or 1280x800@60Hz)


MIPI DSI (up to 1920x1080p60)

Camera Interface


1 x 2-lane MIPI-CSI

SDIO


One SDIO interface


1 x 4-bit SDIO card interface with support lines


1 x SDIO Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 module (Optional)

SPI


Two SPI interfaces with two chip selects per SPI channel.

I2S


Two I2S interfaces

I2C


Typically used for connection to I2S audio CODECs

Four I2C interfaces


Power Management


General Purpose


Camera port 0


LCD Display ID

UART



LCD Display ID


Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#)


Two ports supporting data-only signals (RXD, TXD)

FlexCAN Bus

Two CAN-FD interfaces


Logic level signals from Module based FlexCAN bus protocol controllers


RXD and TXD only

USB


One USB OTG 2.0 Ports with PHY


Four USB 2.0 Host with PHY


USB support signals (VBUS enable, Over-current detect, USB ID signals)

Gigabit Ethernet


Two GbE MDI interfaces


One port supports QoS with TSN


Realtek RTL-8211FD on module


No magnetics on Module


LED support signals

Real-Time Clock (RTC)

External Micro Crystal RV-8263-C8 RTC controller on module

General Purpose I/O

12 x GPIO Signals, specific alternate functions are assigned to some GPIOs


PWM / Tachometer capability


Camera support


CAN Error Signaling


HD Audio reset

System and Power Management Signals


Reset Out and Reset In


Power Button Input


Power Source Sataus


Module Power State Status


System Management Pins


Battery and Battery Charger Management Pins


Carrier Power On Control Pins

Power Consumption (Typical)

2.1W or 4W (with WIFI Module)

Boot Source Select

Three pins to allow selection from carrier board. Select options include to boot from one of the following:


Module eMMC Flash (Default)


Network Boot


Carrier SD Card (Recovery)

Power Supply

3V to 5.25V

Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply


1.8V VDDIO

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

SMARC 2.2 

82 mm x 50 mm by SMARC 2.2 Specification

hardware document Designresurser

hardware document Programvaruguider

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Debian

Developer's Guide

Comprehensive Debian developer guide for building, customizing embedded Linux systems

Real-Time Edge

Developer's Guide

Real-Time Edge Software enables deterministic Linux, industrial networking, low latency applications.

SMARC-iMX93 NXP SMARC 2.2 System-on-Module


  • SMARC v2.0+ modulkompatibilitet
  • Uppstartsplattform för SMARC v2.0+ modul för hårdvaru- och mjukvaruutveckling
  • Utvärderings- och valideringsplattform för SMARC 2.0+ modul
  • Referensdesign för kundens bärarekort
  • Prioriterad teknisk support från Embedian

Ordering Info.


Part Number: EVK-STD-CARRIER-S20


Packing Lists


1 x EVK-STD-CARRIER-S20 carrier board


4 x M2.5 screws


1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)


1 x LVDS cable


1 x LVDS LCD Backlight cable


1 x 12V/3.5A Power Supply


1 x SATA Power cable


1 x 10-way box header to DB9 cable (for console or RS232)


SMARC module not included)


Evaluation Bseboard Features


DC +12V ~ +24V Power input with 2.5mm DC Jack


Accept 1.8V VDDIO SMARC 2.0+ compliant module


Supports all SMARC 2.0+ I/O interfaces


Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

hardware document Beställningsinformation

Artikelnummer

Notes

1


1G: 1GB LPDDR4x


2G: 2GB LPDDR4x

2. I: Industrial Temperature (-40 degree C ~ 85 degree C); Leave it blank if using commercial temperature.

3. W: WiFi and Bluetooth; Leave it blank if not needed.

4. C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Examples


Part Number: SMARC-iMX93-I-C

Description: i.MX93 SMARC 2.2 module with 1GB LPDDR4x, Industrial Temperature (-40 degree C ~ 85 degree C) and Conformal Coating


Part Number: SMARC-iMX93-2G-W

Description: i.MX93 SMARC 2.2 module with 2GB LPDDR4x, WiFi/BT on module and commercial temperature.

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