SMARC-iMX8

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SMARC-iMX8 NXP SMARC 2.0 系统模块

双核 ARM Cortex-A72 CPU（1.6GHz）及四核 ARM Cortex-A53（1.2GHz）
实时 2× ARM Cortex-M4F 协处理器
符合 SMARC 2.0（82mm × 50mm）规范
供货保证至 2038 年

功能亮点
4GB 或 8GB LPDDR4 以及 32GB eMMC HDMI、24 位双通道 LVDS、eDP 和 2 × MIPI-CSI（2-LANE 和 4-LANE） GPU（OpenGL ES 3.2、OpenVX 1.01、OpenCL 2.0、OpenVG 1.1） VPU（4K H.265 解码；1080p H.264 编码） 2 × 千兆以太网（支持 AVB）、1 × USB 3.0、1 × USB OTG、4 × USB 2.0、2 × CAN-FD、4 × UART、6 × I2C、2 × I2S、2 × PCIe 3.0（1-LANE）、1 × SATA 3.0、2 × SPI、TPM、1 × SDIO、12 × GPIO 宽温工作范围：-40°C 至 85°C

Yocto Project、Ubuntu、Debian、Linux 和 RTOS
完整的板级支持包（BSP）和可直接运行的镜像 Yocto Project、Ubuntu 和 Debian BSP 持续的 BSP 更新与维护

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Specifications
Technical Information
Compliance	SMARC 2.0 Compliant
Dimension (W x L)	82mm x 50mm
CPU	NXP i.MX8 2 x 1.6GHz Cortex-A72 Core and 4 x 1.2GHz Cortex-A53 Real-time 2 x ARM Cortex-M4F
GPU	2 x Vivante GC7000XSVX high performance GPU Supports OpenGL ES 3.2, OpenVX 1.01, OpenCL 2.0 and OpenVG 1.1
VPU	4k h.265 Decode, 1080p h.264 encodeXP i.MX9352 2 x 1.7GHz Cortex-A55 Core
Main Memory	32-bit 4GB/8GB LPDDR4 up to 3200MT/s 32GB eMMC (5.x) onboard AT24C32 EEPROM onboard
Display	HDMI 2.0a with HDCP 2.2 and DP 1.3 Dual Channel LVDS display (up to 1920x1080@60Hz) eDP 1.4 (from MIPI-DSI)
TPM	Support TPM 2.0
Camera Interface	1 x 2-lane and 1 x 4-lane MIPI-CS
SDIO	One SDIO interface 1 x 4-bit SDIO card interface with support lines
SPI	Two SPI interfaces with two chip selects per SPI channel.
I2S	Two I2S interfaces Typically used for connection to I2S audio CODECs
SATA	One SATA interface SATA Gen 3.0
PCIe	2 x PCIe Gen 3.0 Lane configuration: 1 x PCIe x2 or 2 x PCIe x1
I2C	Six I2C interfaces Power Management General Purpose Camera 0 Camera 1 LCD Display ID HDMI
UART	Four asynchronous serial ports Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#). Two ports supporting data-only signals (RXD, TXD).
FlexCAN Bus	Two CAN-FD interfaces Logic level signals from Module based FlexCAN bus protocol controllers RXD and TXD only
USB	One USB OTG 2.0 Ports with PHY Four USB 2.0 Host with PHY One USB 3.0 Host with PHY
Gigabit Ethernet	Two GbE MDI interfaces Qualcomm AR8035 PHY on module No magnetics on Module LED support signals
Real-Time Clock (RTC)	External Seiko S35390A controller on module
General Purpose I/O	12 x GPIO Signals, specific alternate functions are assigned to some GPIOs PWM / Tachometer capability Camera support CAN Error Signaling HD Audio reset
System and Power Management Signals	Reset Out and Reset In Power Button Input Power Source Sataus Module Power State Status System Management Pins Battery and Battery Charger Management Pins Carrier Power On Control Pins
Power Consumption	3.5 W (Typical)
Boot Source Select	Three pins to allow selection from carrier board. Select options include to boot from one of the following: Module eMMC Flash (Default) Network Boot Carrier SD Card (Recovery)
Power Supply
3V to 5.25V	Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply 1.8V VDDIO
Temperature
Industrial Temperature Range	-40 degree C ~ 85 degree C
Commercial Temperature Range	0 degree C ~ 60 degree C
Storage Temperature Range	-40 degree C ~ 150 degree C
Junction Temperature Range	-40 degree C ~ 150 degree C
Form Factor
SMARC 2.0	82 mm x 50 mm by SMARC 2.0 Specification

设计资源

软件指南

Yocto Developer's Guide label Comprehensive Yocto developer guide for building, customizing embedded Linux systems Scarthgap Yocto Scarthgap (Kernel 6.6.52) Mickledore Yocto Mickledore (Kernel 6.1.55) Kirkstone Yocto Kirkstone (Kernel 5.15.71) All Release All SMARC-iMX8 Yocto Release	Debian Developer's Guide label Comprehensive Debian developer guide for building, customizing embedded Linux systems Debian 12 Bookworm Debian Bookworm (Kernel 6.6.52) All Release	Ubuntu Developer's Guide label Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems Ubuntu 22.04 Ubuntu 22.04(Kernel 6.1.55) All Release

SMARC-iMX8 NXP SMARC 2.0 系统模块

符合 SMARC v2.0+ 模块规范
用于硬件和软件开发的 SMARC v2.0+ 模块启动平台
SMARC 2.0+ 模块评估与验证平台
客户载板设计参考
来自 Embedian 的优先技术支持

Ordering Info.
Part Number: EVK-STD-CARRIER-S20

Packing Lists
1 x EVK-STD-CARRIER-S20 carrier board 4 x M2.5 screws 1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules) 1 x LVDS cable 1 x LVDS LCD Backlight cable 1 x 12V/3.5A Power Supply 1 x SATA Power cable 1 x 10-way box header to DB9 cable (for console or RS232) SMARC module not included)

Evaluation Bseboard Features
DC +12V ~ +24V Power input with 2.5mm DC Jack Accept 1.8V VDDIO SMARC 2.0+ compliant module Supports all SMARC 2.0+ I/O interfaces Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

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Notes
1 6: DSP in CPU 5: No DSP in CPU
2 QM: CPU is QuadMax Core, 2 x Cortex-A72 + 4 x Cortex-A53 QP: CPU is QuadPlus Core, 1 x Cortex-A72 + 4 x Cortex-A53
3 8G: 8GB LPDDR4 memory 4G: 4GB LPDDR4 memory
4. I: Industrial Temperature (-40 degree C ~ 85 degree C); Leave it blank if using commercial temperature.
5. C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.
Examples
Part Number: *SMARC-iMX8-5-QM-8G-I* Description: QuadMax core i.MX8 processor without DSP SMARC 2.0 module with 8GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)
Part Number: *SMARC-iMX8-5-QP-4G-I* Description: QuadPlus core i.MX8 processor without DSP SMARC 2.0 module with 4GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)
Optional Accessaries
Heat Sinlk
P/N: VTT-HS-8J066B1
Description: Heak sink for SMARC-iMX8MP and SMARC-iMX8

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SMARC-iMX8 NXP SMARC 2.0 系统模块

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设计资源

软件指南

SMARC-iMX8 NXP SMARC 2.0 系统模块

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SMARC-iMX8

分享：

SMARC-iMX8 NXP SMARC 2.0 系统模块

规格

设计资源

软件指南

SMARC-iMX8 NXP SMARC 2.0 系统模块

订购信息

为什么选择 Embedian？

NXP EBS 合作伙伴

TI 直销账户

高质量与高效率的企业文化

深耕 ARM Cortex 平台 20 年