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SMARC-iMX8MM

$135

  • NXP i.MX8M Mini，4 × Cortex-A53 @ 1.8GHz
  • 2GB/4GB LPDDR4，16GB eMMC
  • LVDS，1 × 千兆以太网（Gigabit Ethernet，GbE），1 × MIPI-CSI
  • 2 × CAN、4 × UART、5 × I2C、2 × I2S、1 × PCIe、2 × SPI、1 × USB 2.0 OTG 及 4 × USB 2.0

 

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SKU: SMARC-iMX8MM-6-2G Category: Tag:

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SMARC-iMX8MM NXP SMARC 2.0 系统级模块（SoM）

  • 四核 / 双核 ARM Cortex-A53，1.8GHz
  • 实时 ARM Cortex-M4 协处理器，400MHz
  • 符合 SMARC 2.0 标准（82mm × 50mm）
  • 供货保证至 2038 年

功能亮点


2GB 或 4GB LPDDR4 及 16GB eMMC


24 位双通道 LVDS（1080p），以及 1 × MIPI-CSI（4-LANE）


GPU（支持 OpenGL ES 2.0、OpenVG 1.1 和 G2D）


VPU（1080p60 VP9 / H.265 / H.264 / VP8 解码；1080p60 H.264 / VP8 编码）


1 × GbE（支持 AVB）、1 × USB OTG、4 × USB 2.0、2 × CAN、4 × UART、4 × I2C、2 × I2S、1 × PCIe 2.0（1-LANE）、2 × SPI、1 × SDIO、12 × GPIO


宽温度范围：-40°C 至 85°C

Yocto Project、Debian、Android、Linux 和 RTOS


完整的板级支持包（BSP）及可直接运行的映像文件


Yocto Project、Debian 和 Android BSP


持续的 BSP 更新与维护

加速您的产品设计


完整载板设计套件 – 原理图、物料清单（BOM）、PCB 布局及 SMARC 模块 3D STEP 文件


Embedian 设计工程师直接提供技术支持


Embedian 工程师免费设计评审


载板调试由 Embedian 设计工程师执行


定制 LCD 面板驱动程序适配服务

hardware document 规格参数

Specifications

Technical Information

Compliance

SMARC 2.0 Compliant

Dimension (W x L)

82mm x 50mm

CPU

  • NXP i.MX8M Mini 4/2 x Cortex-A53 @1.8GHz

  • Real-time 400MHz ARM Cortex-M4

GPU

  • GCNanoUltra (3D) and GC320 (2D)

  • OpenGL ES 2.0, OpenVG 1.1 and G2D

  • Up to 1080p60 resolutions

VPU

  • 1080p60 VP9/VP8/H.265/H.264 decoder

  • 1080p60 H.264/VP8 encoder

Main Memory

  • 32-bit 2GB/4GB LPDDR4 up to 3200MT/s

  • 16GB eMMC (5.x) onboard

  • AT24C32 EEPROM onboard

Display

  • Dual Channel LVDS display (up to 1920x1200@60Hz, interface vis MIPI-DSI by TI SN65DSI84 bridge)

Camera Interface

  •  1 x 4-lane MIPI-CSI

SDIO

One SDIO interface

  • 1 x 4-bit SDIO card interface with support lines

SPI

Two SPI interfaces with two chip selects per SPI channel.

I2S

Two I2S interfaces

  • Typically used for connection to I2S audio CODECs

I2C

Four I2C interfaces

  • Power Management

  • General Purpose

  • Camera 0

  • LCD Display ID

UART


  • Four asynchronous serial ports

  • Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).

  • Two ports supporting data-only signals (RXD, TXD).

CAN Bus

Two CAN 2.0b interfaces (via Microchip MCP2515 SPI to CAN bridge)

  • Logic level signals from Module based CAN bus protocol controllers

  • RXD and TXD only

  • Maxmium baud rate at 250k without package loss.

USB

  • One USB OTG 2.0 Ports with PHY

  • Four USB 2.0 Host with PHY

PCIe

  • One PCIe 2.0 (1-lane)

  • Common PCIe wake signal

Gigabit Ethernet

  • One GbE MDI interfaces

  • Realtek RTL-8211FD-CG PHY on module

  • No magnetics on Module

  • LED support signals

Real-Time Clock (RTC)

External Seiko S35390A controller on module

General Purpose I/O

12 x GPIO Signals, specific alternate functions are assigned to some GPIOs

  • PWM / Tachometer capability

  • Camera support

  • CAN Error Signaling

  • HD Audio reset

System and Power Management Signals

  • Reset Out and Reset In 

  • Power Button Input

  • Power Source Sataus

  • Module Power State Status

  • System Management Pins

  • Battery and Battery 

  • Charger Management Pins

  • Carrier Power On Control Pins

Power Consumption

  • 1.6W (Typical)

  • 2.1W (Max)

Boot Source Select

Three pins to allow selection from carrier board. Select options include to boot from one of the following:

  • Module eMMC Flash (Default)

  • Network Boot

  • Carrier SD Card (Recovery)

Power Supply

3V to 5.25V

Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply

  • 1.8V VDDIO

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

SMARC 2.0

82 mm x 50 mm by SMARC 2.0 Specification

hardware document 设计资源

 

hardware document 软件指南

Yocto

Developer's Guide
;

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Debian

Developer's Guide
;

Comprehensive Debian developer guide for building, customizing embedded Linux systems

Android

Developer's Guide
;

Comprehensive Android developer guide for building, customizing embedded Linux systems

SMARC-iMX8M NXP SMARC 2.0 系统级模块（SoM）

  • 符合 SMARC v2.0+ 模块规范
  • 用于硬件与软件开发的 SMARC v2.0+ 模块启动平台
  • SMARC 2.0+ 模块评估与验证平台
  • 客户载板（Carrier Board）设计参考
  • 由 Embedian 提供的优先技术支持
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Packing Lists


1 x EVK-STD-CARRIER-S20 carrier board


4 x M2.5 screws


1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)


1 x LVDS cable


1 x LVDS LCD Backlight cable


1 x 12V/3.5A Power Supply


1 x SATA Power cable


1 x 10-way box header to DB9 cable (for console or RS232)


SMARC module not included)

Evaluation Bseboard Features


DC +12V ~ +24V Power input with 2.5mm DC Jack


Accept 1.8V VDDIO SMARC 2.0+ compliant module


Supports all SMARC 2.0+ I/O interfaces


Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

硬件文档 订购信息

零件编号

Notes

1


6: Quad Core Cortex-A53


5: Quad Lite Core Cortex-A53 (no VPU)

2


2G: 2GB LPDDR4


4G: 4GB LPDDR4

3. I: Industrial Temperature (-40 degree C ~ 85 degree C); Leave it blank if commercial temperature.

4. C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Examples


Part Number: SMARC-iMX8MM-6-4G-I

Description: Quad core Cortex-A53 i.MX8M Mini processor SMARC 2.0 module with 4GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)


Part Number: SMARC-iMX8MM-5-2G

Description: Quad core Cortex-A53 i.MX8M Mini processor SMARC 2.0 module with 2GB LPDDR4, Commercial Temperature (0 degree C ~ 60 degree C)

Optional Accessories

P/N: VTT-HS-8J066B2

Heat Sink


Description: Heak sink for SMARC-iMX8MM (Not all applications require it.)

Packing List


1 x SMARC-iMX8MM Module

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