EDGE-RZV2H

概述

規格

文件

軟體

EDGE-RZV2H RZ/V2H 單板電腦（SBC）

Renesas RZ/V2H：4 × Cortex-A55 @1.8GHz、2 × Cortex-R8 @800MHz，以及 1 × Cortex-M33 @200MHz
DRP-AI 人工智慧加速器，支援最高 80 TOPS 的視覺 AI（稀疏運算，跳過零權重）
3D GPU（Mali-G31），支援 OpenGL ES 3.2/3.1/3.0/2.0、Vulkan 1.2 與 OpenCL 2.0（完整規格）
支援 H.264（1920×1080@60fps）/ H.265（3840×2160@30fps）編碼與解碼
尺寸：100mm × 100mm，採用被動式散熱設計
供貨保證至 2038 年

產品特色亮點
8GB 或 16GB LPDDR4 記憶體，128GB eMMC HDMI 連接埠（透過 MIPI-DSI 轉 HDMI 橋接） 4 個 4 通道 MIPI-CSI FPC 連接器，每個連接器最高支援 8.4 Gbps 頻寬 1 個 M.2（PCIe 3.0 / UART / USB 2.0）Key E 連接器（用於 Wi-Fi） 1 個 M.2（I2S / USB 2.0 / USB 3.2）Key B 連接器（用於 4G / 5G LTE） 2 個 GbE RJ-45 連接器 2 個 USB 3.2 Type-A 連接埠，1 個 mini USB 用戶端 mini-B 連接埠 2 個 SPI 排針 1 個 50 針擴充接頭（2 × UART、2 × CAN-FD、1 × SPI、2 × I²C、6 × GPIO、1 × USB 3.2、2 × USB 2.0） 1 個電源指示 LED 與 1 個可程式化 LED 1 個重置按鈕寬溫操作範圍：-40°C 至 85°C

Yocto 專案、Ubuntu、Linux 與 RTOS
完整的板級支援套件（BSP）與可立即執行的映像檔 Yocto 專案與 Ubuntu BSP 持續的 BSP 更新與維護

加速您的產品設計
完整的設計套件——BSP 與 3D STEP 檔案由 Embedian 設計工程師提供直接的技術支援由 Embedian 工程師提供免費的設計審查為客製化 LCD 面板提供驅動程式適配服務

規格

Specifications
Technical Information
Dimension (W x L x H)	100mm x 100mm x 21mm
CPU	Renesas RZ/V2H (R9A09G057H48GBG) 4 x Cortex-A55 @1.8GHz 2 x Cortex-R8 @800MHz for hard real-time processing 1 x Cortex-M33 @200Mhz for system management control
GPU	Arm Mali-G31 Support OpenGL ES 2.0/3.0/3.2, Vulkan 1.2 and OpenCL 2.0 (Full Profile)
AI accelerator (DRP-AI)	DRP-AI (AI-MAC + DRP0) Up to 80 TOPS (sparse, skip zero weights) Up to 8 dense TOPS
Image Signal Processor Unit (ISP)	Arm Mali-C55 1 unit, supporting 4K Maximum pixel rate: 630 Mpixels/s Supports input formats: RAW8, 10, 12, 14, 16, 20 Supports output formats: YUV422, YUV420, RGB
Video Codec Unit	H.264/H.265 codec module Support for encoding and decoding Support for encoding and decoding – H.264/AVC (High Profile, level 4.2; Main Profile, level 4.2; Baseline Profile, level 4.2) – H.265/HEVC (Main Profile, level 5) Maximum size Maximum size – (H.264) 1920 × 1080 × 60 fps – (H.265) 3840 × 2160p × 30 fps I-/P-slice supported for H.264 I-/P-slice supported for H.264/H.265 encoding and ddecoding1
Main Memory	32-bit 8GB/16GB LPDDR4x up to 2.133 GHz 128GB eMMC (5.x) onboard M24C32 EEPROM onboard
Display	HDMI (up to 1920x1080p60) Connector implement via LT9611UXC MIPI-DSI to HDMI bdrige
Gigabit Ethernet	2 x RJ45 connector along the board edge Renesas RZ/V2H integrated two RGMIIs Speed: 10/100/1000 Mbps PHY: Realtek RTL8211FD(I)-CG
USB	Two USB 3.2 Host Connector (Type A) on the board edge One USB 2.0 host signal set on the M.2 2230 Key E connector One USB 3.2 and USB 2.0 host signal set on the M.2 2230 Key B connector Two USB 2.0 and USB 3.2 Host signals set on the EIO 50-pin 2.0mm expansion box header
Camera Interface	4 x 4-lane MIPI-CSI 0.5mm 22P FPC(V) Connector on the rear side
SD interface	one 4-bit push-push microSD connector
SIM card interface	one push-push nanoSIM connector
SPI	Two SPI interfaces with two chip selects per SPI channel. One SPI interfaces on the EIO 50‑pin 2.0 mm expansion box header Two SPI on two 1x6P 2.00mm headers (one cs# each)
LED	1 x green power indication LED 1 x yellow programmable LED
M.2 Type 2230 Key E Connector	One M.2 Type 2230 Key E Connector Support 1 x USB 2.0 signals Support 1 x 4-wire UARTs Support 1 x PCI 2.0 signals
M.2 Type 3052 Key B Connector	One M.2 Type 3052 Key B Connector Support 1 x USB 3.2 signals Support 1 x USB 2.0 signals Support 1 x I2S signals
UART	Four UARTS 1 x 2-wire on debug header 1 x 4-wire on M.2 Connector 1 × 4‑wire and 1 × 2‑wire interfaces on the EIO 50‑pin 2.0 mm expansion box header
RTC	Backup Battery by 2-pin type connector External Micro Crystal RV-8263-C8 RTC controller
Reset	1 Reset ButtonOne USB OTG 2.0 Ports with PHY
Rear I/O Expansion Header	EIO50 50-pin 2.00mm Box Header that includes 2 x USB 2.0 Host 1 x USB 3.0 Host 2 x CAN-FD (TTL) 1 x SPI 2 x I2C 2 x UARTs (1 x 4-wire and 1 x 2-wire) 6 x GPIOs
General Purpose I/O	5 x GPIOs on 10 pos 1mm header 6 x GPIOs on EIO 50-pin box header
Boot Source Select	Select options include to boot from one of the following: eMMC Flash (Default) microSD Card (Recovery)
Power Supply
12V input	Power Supply Voltage: 12V DC-IN by lockable DC Jack (or 2-pin type connector by BOM option) AT or ATX mode Power Consumption: 6.5 W
Expansion
1 x M.2 2230 Key E Slot (USB 2.0/UART/PCIe 3.0) 1 x M.2 3052 Key B Slot (USB 2.0/USB3.2/I2S) 1 x M.2 3052 Key B Slot (USB 2.0/USB3.2/I2S) EIO50 50-pin 2.00mm Box Header (2 x UARTs, 2 x USB 2.0, 1 x USB 3.0, 2 x I2C, 1 x SPI, 6 GPIOs, 2 x CAN-FD) SD Socket: 1 x Micro SD Socket
Temperature
Industrial Temperature Range	-40 degree C ~ 85 degree C
Commercial Temperature Range	0 degree C ~ 60 degree C
Storage Temperature Range	-40 degree C ~ 150 degree C
Junction Temperature Range	-40 degree C ~ 150 degree C
Form Factor
Dimension	Dimensions: 100 x 100 x 21 mm Weight: 0.3kg
Certifications
CE/FCC class B

軟體指南

Yocto Developer's Guide label Comprehensive Yocto developer guide for building, customizing embedded Linux systems Scarthgap Yocto Scarthgap (Kernel 6.6.52) All Release All SMARC-iMX8 Yocto Release	Ubuntu Developer's Guide label Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems Ubuntu 22.04 Ubuntu 22.04(Kernel 6.1.55) All Release All Ubuntu Release

分享：

EDGE-RZV2H RZ/V2H 單板電腦（SBC）

規格

軟體指南

為什麼選擇 Embedian？

NXP EBS 合作夥伴

TI 直營帳戶

追求高品質與高效率的企業文化

深耕 ARM Cortex 平台 20 年

常用連結

客戶服務

我們的社群媒體

支付方式

Recommended for you Refresh

Need a Quote for This Product?

Have a question about this product?

EDGE-RZV2H

分享：

EDGE-RZV2H RZ/V2H 單板電腦（SBC）

規格

軟體指南

為什麼選擇 Embedian？

NXP EBS 合作夥伴

TI 直營帳戶

追求高品質與高效率的企業文化

深耕 ARM Cortex 平台 20 年