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SMARC-FiMX6

Price range: $130 through $165

  • NXP i.MX6 4/2/1 x Cortex-A9 @1GHz
  • 1GB/2GB/512MB DDR3L, 8GB eMMC
  • HDMI, LVDS, 1x GBE, 1x MIPI-CSI
  • 2x CANs, 4x UARTs, 4x I2C, 1x I2S, 1x PCIe , 2x SPI, 1x USB2.0 OTG, 1x USB 2.0 host

 

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SKU: SMARC-FiMX6-D-2G-I Category: Tag:

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SMARC-FiMX6 NXP SMARC 1.1/1.0 System-on-Module

  • Quad/Dual/Dual Lite/Solo-core ARM Cortex-A9, 1.2GHz (800Mhz for industrial temp.)
  • Real-time ARM Cortex-M4 co-processor, 266MHz
  • SMARC 1.1 (S158 floating) and 1.0 (S158 grounded) Compliance
  • Wx L: 82mm x 50mm
  • Availability guaranteed until 2031

Feature Highlights


2GB/1GB/512MB DDR3L and 8GB eMMC


HDMI, 24-bit dual-channel LVDS (1080p), and 1 x MIPI-CSI (2-LANE)


GPU 3D (Vivante GC2000) and GPU 2D (Vivante GC355 and GC320)


VPU (Video Decode: 1080p60 h.264; Video Encode: 1080p30 H.264)


1 x GbE, 1 x USB 2.0 OTG, 1 x USB 2.0 Host, 2 x CAN, 4 x UARTs, 4 x I2C, 2 x I2S, 1 x PCIe 2.0 (1-LANE), 2 x SPI, 1 x SDIO, 12 x GPIOs


Wide temperature range of -40 degree C to 85 degree C

Yocto Project, Linux and RTOS


Full Board Support Package and ready-to-run images


Yocto Project BSP


Continuous BSP updates and maintenance

Speed Up your Product Design


Full carrier-board design package - schematics, BOM, PCB layout, Library Symbol, CAD Symbol and 3D step files


Direct technical support by Embedian design engineers


Free design review by Embedian engineers


Carrier board debug by Embedian design engineers


Driver adaptation service for custom LCD panels

hardware document Specifications

Specifications

Technical Information

Compliance

SMARC 1.1 (S158 grounded) and 1.0 (S158 floating) Compliant

Dimension (W x L)

82mm x 50mm

CPU

  • NXP i.MX6 4/2/1 x Cortex-A9 @1.2GHz (800Mhz for industrial temp.)

GPU

  • Vivante GC2000 (3D, dual and quad core, supports OpenGL ES 3.0, OpenCL and higher performance graphics.)

  • Vivante GC880 (3D, dual lite core and solo core, supports OpenGL ES 2.0 only)

  • Vivante GC355 and GC320 (2D, dual core and solo core)

  • emulated 2D on GPU + Vivante GC320 (2D, dual lite core and solo core)

  • Up to 1080p60 resolutions

VPU

  • Video Decode: 1080p 60 h.264

  • Video Encode: 1080p30 H.264

Main Memory

  • 2GB/1GB(dual lite)/512MB(solo) DDR3L

  • 8GB eMMC (5.x) onboard

  • 4MB SPI NOR Flash

  • AT24C32 EEPROM onboard

Display

  • HDMI 1.4

  • Dual Channel LVDS display

  • Up to 1080p60

Camera Interface

  • 1 x 2-lane MIPI-CSI

SDIO

One SDIO interface

  • 1 x 4-bit SDIO card interface with support lines

SPI

Two SPI interfaces with two chip selects per SPI channel.

I2S

One I2S interfaces

  • Typically used for connection to I2S audio CODECs

I2C

Four I2C interfaces

  • Power Management

  • General Purpose

  • Camera 0

  • LCD Display ID

UART


  • Four asynchronous serial ports

  • Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).

  • Two ports supporting data-only signals (RXD, TXD).

CAN Bus

Two CAN 2.0b interfaces

  • Logic level signals from Module based CAN bus protocol controllers

  • RXD and TXD only

USB

  • One USB OTG 2.0 Ports with PHY

  • One USB 2.0 Host with PHY

PCIe

  • One PCIe 2.0 (1-lane)

  • Common PCIe wake signal

Gigabit Ethernet

  • One GbE MDI interfaces

  • Realtek RTL-8211FD-CG PHY on module

  • No magnetics on Module

  • LED support signals

Real-Time Clock (RTC)

External Seiko S35390A controller on module

General Purpose I/O

12 x GPIO Signals, specific alternate functions are assigned to some GPIOs

  • PWM / Tachometer capability

  • Camera support

  • CAN Error Signaling

  • HD Audio reset

System and Power Management Signals

  • Reset Out and Reset In 

  • Power Button Input

  • Power Source Sataus

  • Module Power State Status

  • System Management Pins

  • Battery and Battery 

  • Charger Management Pins

  • Carrier Power On Control Pins

Power Consumption

  • 1.55W ~ 3.6W (Typical)

Heat Sink

VTT-HS-8J064

  • Note: i.MX6 quad core and dual core need heat sink

Boot Source Select

Three pins to allow selection from carrier board. Select options include to boot from one of the following:

  • Module NOR Flash (Default)

  • Module eMMC Flash

  • Network Boot

  • Carrier SD Card (Recovery)

Power Supply

3V to 5.25V

Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply

  • 1.8V (S158 grounded) or 3.3V (S158 floating) VDDIO 

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

SMARC 1.1 or 1.0

82 mm x 50 mm by SMARC 1.1 and 1.0 Specification

hardware document Design Resources

[Download not found]
[Download not found]
 

hardware document Software Guides

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Android

Developer's Guide

Comprehensive Android developer guide for building, customizing embedded Linux systems

  • Android Nougat (N7.1.2_2.0.0)

    Android Nougat(Kernel 4.9)

  • Android Marshmallow (M6.0.1_2.0.1 BSP)

    Android Marshmallow (Kernel 4.1)

  • All Release

    All Android Release

SMARC-FiMX6 NXP SMARC 2.0/1.1 System-on-Module

  • SMARC v2.0+ module compliance
  • SMARC v2.0+ module bring-up platform for hardware and software development
  • SMARC 2.0+ module evaluation and validation platform
  • Customer carrier board design reference
  • Priority technical support from Embedian

Ordering Info.


Part Number: EVK-STD-CARRIER-S20

Packing Lists

  • 1 x EVK-STD-CARRIER-S20 carrier board

  • 4 x M2.5 screws

  • 1 x  bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)

  • 1 x LVDS cable

  • 1 x LVDS LCD Backlight cable

  • 1 x 12V/3.5A Power Supply

  • 1 x SATA Power cable

  • 1 x 10-way box header to DB9 cable (for console or RS232)

  • SMARC module not included)

Evaluation Bseboard Features

  • DC +12V ~ +24V Power input with 2.5mm DC Jack

  • Accept 1.8V VDDIO SMARC 2.0+ compliant module

  • Supports all SMARC 2.0+ I/O interfaces

  • Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

hardware document Ordering Information

Part Number

Notes

1.

  • Q: Quad Core Cortex-A9

  • D: Dual Core Cortex-A9

  • U: Dual Lite Core Cortex-A9

  • S: Solo Core Cortex-A9

2.

  • 2GB: 2GB DDR3L memory

  • 1GB: 1GB DDR3L memory

  • Leave it blank if solo core (512MB DDR3L)

3.

  • I: Industrial Temperature (-40 degree C ~ 85 degree C); Only industrial temperature option for this part.

4.

  • C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Example

  • Part Number: SMARC-FiMX6-D-2G-I

Description: Dual core Cortex-A9 i.MX6 processor SMARC 1.1/1.0 module with 2GB DDR3L, Industrial Temperature (-40 degree C ~ 85 degree C)

  • Part Number: SMARC-FiMX6-U-1G

Description: Dial Lite core Cortex-A9 i.MX6 processor SMARC 1.1/1.0 module with 1GB DDR3L, Commercial Temperature (0 degree C ~ 60 degree C)

Optional Accessaries

Heat Sink

  • P/N: VTT-HS-8J064

Description: Heak sink for SMARC-FiMX6 (dual and quad core i.MX6 need heat sink)

Why choose Embedian?

NXP EBS Partner

TI Direct Account

A Culture of High Quality and Efficiency

Dedicated on ARM-Cortex Platform for 20 years