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NXP i.MX9352 2 x 1.7GHz Cortex-A55 Core
Real-time 250Mhz ARM Cortex-M33
ARM Ethos-U65 microNPU (ML) 0.5 TOPs
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16-bit 1GB/2GB LPDDR4x up to 3200MT/s
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Single Channel LVDS display (up to 1366x768@60Hz or 1280x800@60Hz)
MIPI DSI (up to 1920x1080p60)
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1 x 4-bit SDIO card interface with support lines
1 x SDIO Wi-Fi 11a/b/g/n/ac/ax + Bluetooth 5.3 module (Optional)
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| Two SPI interfaces with two chip selects per SPI channel. |
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Typically used for connection to I2S audio CODECs
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Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#)
Two ports supporting data-only signals (RXD, TXD)
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Logic level signals from Module based FlexCAN bus protocol controllers
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One USB OTG 2.0 Ports with PHY
Four USB 2.0 Host with PHY
USB support signals (VBUS enable, Over-current detect, USB ID signals)
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One port supports QoS with TSN
Realtek RTL-8211FD on module
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| External Micro Crystal RV-8263-C8 RTC controller on module |
| 12 x GPIO Signals, specific alternate functions are assigned to some GPIOs
PWM / Tachometer capability
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System and Power Management Signals |
Module Power State Status
Battery and Battery Charger Management Pins
Carrier Power On Control Pins
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Power Consumption (Typical) | 2.1W or 4W (with WIFI Module) |
| Three pins to allow selection from carrier board. Select options include to boot from one of the following:
Module eMMC Flash (Default)
Carrier SD Card (Recovery)
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| Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply |
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Industrial Temperature Range | -40 degree C ~ 85 degree C |
Commercial Temperature Range | |
Storage Temperature Range | -40 degree C ~ 150 degree C |
Junction Temperature Range | -40 degree C ~ 150 degree C |
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| 82 mm x 50 mm by SMARC 2.2 Specification |