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OSM-MP255-SF

Price range: $80 through $100

  • ST STM32MP255C 2 x Cortex-A35 @1.2GHz
  • Real-time ARM Cortex-M33 co-processor, 400MHz
  • 3D GPU (VeriSilicon) up to 800MHz
  • 1GB/2GB LPDDR4, 16GB eMMC
  • AI/ML Neural Processing Unit(NPU) up to 1.35 TOPS
  • 1 x 4-LANE MIPI-DSI up to 2048×1538@60Hz, 2x GBEs and 2 x 2-LANE MIPI-CSI
  • 1x USB 3.0 or 1 x PCIe 2.0, 1 x USB 2.0 OTG and 1x USB2.0 host, 24x extra GPIOs
  • 2 x CAN-FD, 1 x SDIOs, 5 x UARTs, 3 x I2C, 2 x I2S, 2 x SPI, 4 x PWMs, 2x ADCs

 

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SKU: OSM-MP255-1G-I Category: Tag:

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OSM-MP255-SF NXP OSM 1.1 System-on-Module

  • Dual-core ARM Cortex-A35 CPU, 1.2GHz
  • Integrated AI/ML Neural Processing Unit (NPU) up to 1.35 TOPS
  • 3D GPU (VeriSilicon) up to 800MHz
  • Real-time ARM Cortex-M33 co-processor, 400MHz
  • OSM 1.1 Size-S (30mm x 30mm) Compliance
  • Availability guaranteed until 2038

Feature Highlights


1GB or 2GB LPDDR4 and 16GB eMMC


4-LANE MIPI-DSI (2048×1538@60Hz) and 2 x 2-LANE MIPI-CSI


2 x GbE , 1 x USB OTG, 1 x USB 2.0, 1 x USB 3.0 or PCIe 2.0, 1 x SDIO, 2 x CAN-FD, 5 x UARTs, 3 x I2C, 2 x I2S, 2 x SPI, 24 x GPIOs, 4 x PWMs and 2 x ADCs


Wide temperature range of -40 degree C to 85 degree C

Yocto Project, Linux and RTOS


Full Board Support Package and ready-to-run images


Yocto Project BSP


Continuous BSP updates and maintenance

Speed Up your Product Design


Full carrier-board design package - schematics, BOM, PCB layout, Library Symbol, CAD Symbol and 3D step files


Direct technical support by Embedian design engineers


Free design review by Embedian engineers


Carrier board debug by Embedian design engineers


Driver adaptation service for custom LCD panels

hardware document Specifications

Specifications

Technical Information

Compliance

OSM 1.1 Size-S Compliant

Dimension (W x L)

30mm x 30mm

CPU



ST STM32MP255C 2 x 1.2GHz Cortex-A35 Core


Real-time 400Mhz ARM Cortex-M33


VeriSilicon NPU (ML) 1.35 TOPs

GPU


VeriSilicon 3D graphics accelerator


Support OpenGL ES 3.x, Vulkan 1.2 / 1.3, OpenCL 3.0 and OpenVX 1.3

Main Memory



16-bit 1GB/2GB LPDDR4x up to 3200MT/s


16GB eMMC (5.x) onboard


M24C32 EEPROM onboard

Display


4-LANE MIPI DSI (up to 2048×1538@60Hz)

Camera Interface


2 x 2-lane MIPI-CSI

SDIO


One SDIO interface


1 x 4-bit SDIO card interface with support lines

SPI


Two SPI interfaces with two chip selects per SPI channel.

I2S

Two I2S interfaces


Typically used for connection to I2S audio CODECs

I2C

Three I2C interfaces

UART


Five asynchronous serial ports


Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).


Three ports supporting data-only signals (RXD, TXD).

FlexCAN Bus

Two CAN-FD interfaces


Logic level signals from Module based FlexCAN bus protocol controllers


RXD and TXD only

USB


One USB 3.0 with PHY or PCIe 2.0 (configured by device tree)


One USB OTG 2.0 Ports with PHY


One USB 2.0 Host with PHY

Gigabit Ethernet


Two GbE MDI interfaces


PHY and magnetics are not on Module


LED support signals

Real-Time Clock (RTC)

External Micro Crystal RV-8263-C8 RTC controller on module

General Purpose I/O

24 x GPIO Signals

PWM


4 x PWMs

ADC


2 x ADCs

Power Consumption (Typical)

1.8 W

Boot Source Select

Select options include to boot from one of the following:


Module eMMC Flash (Default)


Carrier SD Card (Recovery)

Power Supply

Fixed 5V


5V +/- 5% power input voltage


1.8V VDDIO

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

OSM 1.1 Size-S 

30 mm x 30 mm by OSM 1.1 Size-S Specification

 

hardware document Software Guides

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

OSM-MP255-SF ST STM32MP255C OSM 1.1 Evaluation Kit

  • OSM-MP255-SF module bring-up platform for hardware and software development
  • OSM-MP255-SF module evaluation and validation platform
  • Customer carrier board design reference
  • Priority technical support from Embedian
  • Can serve as a single board computer (SBC) product.

Ordering Info.


Part Number: EVK-pITX-OSM-MP255

Packing Lists


1 x pITX-OSM-MP255 SBC


1 x Heat Sink


1 x bootable micro-SD card with image pre-installed


1 x 12V/3.5A Power Supply


1 x pITX-IOB-2201 I/O expansion board

Evaluation Bseboard Features


DC +12V Power input with 2.5mm DC Jack


Supports all OSM-MP255-SF I/O interfaces


An additional 50-pin I/O Box Header and expansion board


Form factor: 100mm x 100mm x 21 mm

hardware document Ordering Information

Part Number

Notes

1


1G: 1GB LPDDR4x


2G: 2GB LPDDR4x

2. I: Industrial Temperature (-40 degree C ~ 85 degree C); Leave it blank if commercial temperature.

Examples


Part Number: OSM-MP255-SF-2G-I

Description: STM32MP255C OSM 1.1 module with 2GB LPDDR4x, Industrial Temperature (-40 degree C ~ 85 degree C)


Part Number: OSM-MP255-SF-1G

Description: STM32MP255C OSM 1.1 module with 1GB LPDDR4x and commercial temperature.)

Why choose Embedian?

NXP EBS Partner

TI Direct Account

A Culture of High Quality and Efficiency

Dedicated on ARM-Cortex Platform for 20 years