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SMARC-iMX8

$300


  • NXP i.MX8 2 × Cortex-A72 @1,6 GHz et 4 × Cortex-A53 @1,2 GHz
  • 4 Go/8 Go LPDDR4, 32 Go eMMC
  • HDMI/DP, LVDS, eDP et 2 × GBE avec AVB, 2 × MIPI-CSI
  • 2 × CAN-FD, 4 × UART, 6 × I2C, 2 × I2S, 2 × PCIe3, 2 × SPI, SATA, 1 × USB2.0 OTG, 4 × USB2.0, 1 × USB 3.0

 

or
SKU: SMARC-iMX8-5-QP-4G Categories: Tag:

Partager :

SMARC-iMX8 NXP SMARC 2.0 Module système


  • CPU double cœur ARM Cortex-A72 à 1,6 GHz et quadricœur ARM Cortex-A53 à 1,2 GHz
  • Coprocesseur temps réel 2× ARM Cortex-M4F
  • Conforme à la norme SMARC 2.0 (82 mm × 50 mm)
  • Disponibilité garantie jusqu’en 2038

Points forts


4 Go ou 8 Go de LPDDR4 et 32 Go eMMC


HDMI, LVDS double canal 24 bits, eDP et 2 × MIPI-CSI (2-LANE et 4-LANE)


GPU (OpenGL ES 3.2, OpenVX 1.01, OpenCL 2.0, OpenVG 1.1)


VPU (décodage H.265 4K ; encodage H.264 1080p)


2 × GbE avec AVB, 1 × USB 3.0, 1 × USB OTG, 4 × USB 2.0, 2 × CAN-FD, 4 × UART, 6 × I2C, 2 × I2S, 2 × PCIe 3.0 (1-LANE), 1 × SATA 3.0, 2 × SPI, TPM, 1 × SDIO, 12 × GPIO


Large plage de température : -40°C à 85°C


Yocto Project, Ubuntu, Debian, Linux et RTOS


Package de support de carte complet (BSP) et images prêtes à l’emploi


BSP Yocto Project, Ubuntu et Debian


Mises à jour continues et maintenance du BSP


Accélérez la conception de votre produit


Pack complet de conception de carte porteuse – schémas, nomenclature (BOM), disposition PCB et fichiers 3D STEP


Support technique direct par les ingénieurs de conception Embedian


Revue de conception gratuite par les ingénieurs Embedian


Débogage de la carte porteuse par les ingénieurs de conception Embedian


Service d’adaptation de pilotes pour panneaux LCD personnalisés

hardware document Spécifications

Specifications

Technical Information

Compliance

SMARC 2.0 Compliant

Dimension (W x L)

82mm x 50mm

CPU


NXP i.MX8 2 x 1.6GHz Cortex-A72 Core and 4 x 1.2GHz Cortex-A53


Real-time 2 x ARM Cortex-M4F

GPU


2 x Vivante GC7000XSVX high performance GPU


Supports OpenGL ES 3.2, OpenVX 1.01, OpenCL 2.0 and OpenVG 1.1

VPU


4k h.265 Decode, 1080p h.264 encodeXP i.MX9352 2 x 1.7GHz Cortex-A55 Core

Main Memory


32-bit 4GB/8GB LPDDR4 up to 3200MT/s


32GB eMMC (5.x) onboard


AT24C32 EEPROM onboard

Display


HDMI 2.0a with HDCP 2.2 and DP 1.3


Dual Channel LVDS display (up to 1920x1080@60Hz)


eDP 1.4 (from MIPI-DSI)

TPM


Support TPM 2.0

Camera Interface


1 x 2-lane and 1 x 4-lane MIPI-CS

SDIO

One SDIO interface


1 x 4-bit SDIO card interface with support lines

SPI

Two SPI interfaces with two chip selects per SPI channel.

I2S

Two I2S interfaces


Typically used for connection to I2S audio CODECs

SATA

One SATA interface


SATA Gen 3.0

PCIe


2 x PCIe Gen 3.0


Lane configuration: 1 x PCIe x2 or 2 x PCIe x1

I2C

Six I2C interfaces


Power Management


General Purpose


Camera 0


Camera 1


LCD Display ID


HDMI

UART



Four asynchronous serial ports


Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).


Two ports supporting data-only signals (RXD, TXD).

FlexCAN Bus

Two CAN-FD interfaces


Logic level signals from Module based FlexCAN bus protocol controllers


RXD and TXD only

USB


One USB OTG 2.0 Ports with PHY


Four USB 2.0 Host with PHY


One USB 3.0 Host with PHY

Gigabit Ethernet


Two GbE MDI interfaces


Qualcomm AR8035 PHY on module


No magnetics on Module


LED support signals

Real-Time Clock (RTC)

External Seiko S35390A controller on module

General Purpose I/O

12 x GPIO Signals, specific alternate functions are assigned to some GPIOs


PWM / Tachometer capability


Camera support


CAN Error Signaling


HD Audio reset

System and Power Management Signals


Reset Out and Reset In


Power Button Input


Power Source Sataus


Module Power State Status


System Management Pins


Battery and Battery Charger Management Pins


Carrier Power On Control Pins

Power Consumption

3.5 W (Typical)

Boot Source Select

Three pins to allow selection from carrier board. Select options include to boot from one of the following:


Module eMMC Flash (Default)


Network Boot


Carrier SD Card (Recovery)

Power Supply

3V to 5.25V

Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply


1.8V VDDIO

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

SMARC 2.0 

82 mm x 50 mm by SMARC 2.0 Specification

hardware document Ressources de conception

 

hardware document Guides logiciels

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Debian

Developer's Guide

Comprehensive Debian developer guide for building, customizing embedded Linux systems

Ubuntu

Developer's Guide

Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems

SMARC-iMX8 NXP SMARC 2.0 Module système


  • Conformité au module SMARC v2.0+
  • Plateforme de démarrage du module SMARC v2.0+ pour le développement matériel et logiciel
  • Plateforme d’évaluation et de validation du module SMARC 2.0+
  • Référence de conception de carte porteuse client
  • Support technique prioritaire d’Embedian

Ordering Info.


Part Number: EVK-STD-CARRIER-S20


Packing Lists


1 x EVK-STD-CARRIER-S20 carrier board


4 x M2.5 screws


1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)


1 x LVDS cable


1 x LVDS LCD Backlight cable


1 x 12V/3.5A Power Supply


1 x SATA Power cable


1 x 10-way box header to DB9 cable (for console or RS232)


SMARC module not included)


Evaluation Bseboard Features


DC +12V ~ +24V Power input with 2.5mm DC Jack


Accept 1.8V VDDIO SMARC 2.0+ compliant module


Supports all SMARC 2.0+ I/O interfaces


Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

hardware document Informations de commande

Numéro de pièce

Notes

1


6: DSP in CPU


5: No DSP in CPU

2


QM: CPU is QuadMax Core, 2 x Cortex-A72 + 4 x Cortex-A53


QP: CPU is QuadPlus Core, 1 x Cortex-A72 + 4 x Cortex-A53

3


8G: 8GB LPDDR4 memory


4G: 4GB LPDDR4 memory

4. I: Industrial Temperature (-40 degree C ~ 85 degree C); Leave it blank if using commercial temperature.

5. C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Examples


Part Number: SMARC-iMX8-5-QM-8G-I

Description: QuadMax core i.MX8 processor without DSP SMARC 2.0 module with 8GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)


Part Number: SMARC-iMX8-5-QP-4G-I

Description: QuadPlus core i.MX8 processor without DSP SMARC 2.0 module with 4GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)

Optional Accessaries

Heat Sinlk


P/N: VTT-HS-8J066B1

Description: Heak sink for SMARC-iMX8MP and SMARC-iMX8

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Partenaire EBS de NXP

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20 ans d’expertise sur la plateforme ARM Cortex