SMARC-FiMX6

Aperçu

SMARC-FiMX6 NXP SMARC 1.1/1.0 Module système (System-on-Module)

ARM Cortex-A9 Quad / Dual / Dual Lite / Solo cœur, 1,2 GHz (800 MHz pour la version température industrielle)
Coprocesseur temps réel ARM Cortex-M4, 266 MHz
Conforme aux normes SMARC 1.1 (S158 flottant) et 1.0 (S158 relié à la masse)
Dimensions (L × l) : 82 mm × 50 mm
Disponibilité garantie jusqu’en 2031

Points forts
2 Go / 1 Go / 512 Mo DDR3L et 8 Go eMMC HDMI, LVDS double canal 24 bits (1080p) et 1 × MIPI-CSI (2 voies) GPU 3D (Vivante GC2000) et GPU 2D (Vivante GC355 et GC320) VPU (Décodage vidéo : 1080p60 H.264 ; Encodage vidéo : 1080p30 H.264) 1 × Ethernet Gigabit, 1 × USB 2.0 OTG, 1 × USB 2.0 Host, 2 × CAN, 4 × UART, 4 × I2C, 2 × I2S, 1 × PCIe 2.0 (1 voie), 2 × SPI, 1 × SDIO, 12 × GPIO Plage de température industrielle : -40 °C à 85 °C

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Accélérez la conception de votre produit
Pack complet de conception de carte porteuse – schémas, nomenclature (BOM), disposition PCB et fichiers 3D STEP Support technique direct par les ingénieurs de conception Embedian Revue de conception gratuite par les ingénieurs Embedian Débogage de la carte porteuse par les ingénieurs de conception Embedian Service d’adaptation de pilotes pour panneaux LCD personnalisés

Spécifications

Specifications
Technical Information
Compliance	SMARC 1.1 (S158 grounded) and 1.0 (S158 floating) Compliant
Dimension (W x L)	82mm x 50mm
CPU	NXP i.MX6 4/2/1 x Cortex-A9 @1.2GHz (800Mhz for industrial temp.)
GPU	Vivante GC2000 (3D, dual and quad core, supports OpenGL ES 3.0, OpenCL and higher performance graphics.) Vivante GC880 (3D, dual lite core and solo core, supports OpenGL ES 2.0 only) Vivante GC355 and GC320 (2D, dual core and solo core) emulated 2D on GPU + Vivante GC320 (2D, dual lite core and solo core) Up to 1080p60 resolutions
VPU	Video Decode: 1080p 60 h.264 Video Encode: 1080p30 H.264
Main Memory	2GB/1GB(dual lite)/512MB(solo) DDR3L 8GB eMMC (5.x) onboard 4MB SPI NOR Flash AT24C32 EEPROM onboard
Display	HDMI 1.4 Dual Channel LVDS display Up to 1080p60
Camera Interface	1 x 2-lane MIPI-CSI
SDIO	One SDIO interface 1 x 4-bit SDIO card interface with support lines
SPI	Two SPI interfaces with two chip selects per SPI channel.
I2S	One I2S interfaces Typically used for connection to I2S audio CODECs
I2C	Four I2C interfaces Power Management General Purpose Camera 0 LCD Display ID
UART	Four asynchronous serial ports Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#). Two ports supporting data-only signals (RXD, TXD).
CAN Bus	Two CAN 2.0b interfaces Logic level signals from Module based CAN bus protocol controllers RXD and TXD only
USB	One USB OTG 2.0 Ports with PHY One USB 2.0 Host with PHY
PCIe	One PCIe 2.0 (1-lane) Common PCIe wake signal
Gigabit Ethernet	One GbE MDI interfaces Realtek RTL-8211FD-CG PHY on module No magnetics on Module LED support signals
Real-Time Clock (RTC)	External Seiko S35390A controller on module
General Purpose I/O	12 x GPIO Signals, specific alternate functions are assigned to some GPIOs PWM / Tachometer capability Camera support CAN Error Signaling HD Audio reset
System and Power Management Signals	Reset Out and Reset In Power Button Input Power Source Sataus Module Power State Status System Management Pins Battery and Battery Charger Management Pins Carrier Power On Control Pins
Power Consumption	1.55W ~ 3.6W (Typical)
Heat Sink	VTT-HS-8J064 Note: i.MX6 quad core and dual core need heat sink
Boot Source Select	Three pins to allow selection from carrier board. Select options include to boot from one of the following: Module NOR Flash (Default) Module eMMC Flash Network Boot Carrier SD Card (Recovery)
Power Supply
3V to 5.25V	Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply 1.8V (S158 grounded) or 3.3V (S158 floating) VDDIO
Temperature
Industrial Temperature Range	-40 degree C ~ 85 degree C
Commercial Temperature Range	0 degree C ~ 60 degree C
Storage Temperature Range	-40 degree C ~ 150 degree C
Junction Temperature Range	-40 degree C ~ 150 degree C
Form Factor
SMARC 1.1 or 1.0	82 mm x 50 mm by SMARC 1.1 and 1.0 Specification

设计资源

Guides logiciels

Yocto Developer's Guide label Comprehensive Yocto developer guide for building, customizing embedded Linux systems Scarthgap Yocto Scarthgap (Kernel 6.6.52) Mickledore Yocto Mickledore (Kernel 6.1.55) Kirkstone Yocto Kirkstone (Kernel 5.15.71) All Release All SMARC-FiMX6 Yocto Release	Android Developer's Guide label Comprehensive Android developer guide for building, customizing embedded Linux systems Android Nougat (N7.1.2_2.0.0) Android Nougat(Kernel 4.9) Android Marshmallow (M6.0.1_2.0.1 BSP) Android Marshmallow (Kernel 4.1) All Release All Android Release

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

Conformité au module SMARC v2.0+
Plateforme de mise en service SMARC v2.0+ pour le développement matériel et logiciel
Plateforme d’évaluation et de validation du module SMARC 2.0+
Référence de conception de carte porteuse client
Support technique prioritaire fourni par Embedian

Ordering Info.
Part Number: EVK-STD-CARRIER-S20

Packing Lists
1 x EVK-STD-CARRIER-S20 carrier board 4 x M2.5 screws 1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules) 1 x LVDS cable 1 x LVDS LCD Backlight cable 1 x 12V/3.5A Power Supply 1 x SATA Power cable 1 x 10-way box header to DB9 cable (for console or RS232) SMARC module not included)

Evaluation Bseboard Features
DC +12V ~ +24V Power input with 2.5mm DC Jack Accept 1.8V VDDIO SMARC 2.0+ compliant module Supports all SMARC 2.0+ I/O interfaces Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

Informations de commande

Notes
1.	Q: Quad Core Cortex-A9 D: Dual Core Cortex-A9 U: Dual Lite Core Cortex-A9 S: Solo Core Cortex-A9
2.	2GB: 2GB DDR3L memory 1GB: 1GB DDR3L memory Leave it blank if solo core (512MB DDR3L)
3.	I: Industrial Temperature (-40 degree C ~ 85 degree C); Only industrial temperature option for this part.
4.	C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.
Example
Part Number: *SMARC-FiMX6-D-2G-I* Description: Dual core Cortex-A9 i.MX6 processor SMARC 1.1/1.0 module with 2GB DDR3L, Industrial Temperature (-40 degree C ~ 85 degree C)
Part Number: *SMARC-FiMX6-U-1G* Description: Dial Lite core Cortex-A9 i.MX6 processor SMARC 1.1/1.0 module with 1GB DDR3L, Commercial Temperature (0 degree C ~ 60 degree C)
Optional Accessaries
Heat Sink
P/N: VTT-HS-8J064
Description: Heak sink for SMARC-FiMX6 (dual and quad core i.MX6 need heat sink)

Partager :

SMARC-FiMX6 NXP SMARC 1.1/1.0 Module système (System-on-Module)

Spécifications

设计资源

Guides logiciels

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

Informations de commande

Pourquoi choisir Embedian ?

Partenaire EBS de NXP

Compte Direct TI

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20 ans d’expertise sur la plateforme ARM Cortex

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SMARC-FiMX6

Partager :

SMARC-FiMX6 NXP SMARC 1.1/1.0 Module système (System-on-Module)

Spécifications

设计资源

Guides logiciels

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

Informations de commande

Pourquoi choisir Embedian ?

Partenaire EBS de NXP

Compte Direct TI

Une culture de haute qualité et d’efficacité

20 ans d’expertise sur la plateforme ARM Cortex