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OSM-RZV2H-LF

Price range: $300 through $400


  • High throughput AI inference at the edge (up to ~80 TOPS) that can handle complex vision models (e.g., image classification, detection) locally
  • Renesas RZ/V2H 4 x Cortex-A55 @1.8GHz, 2 x Cortex-R8 @800MHz and 1 x Cortex-M33 @200MHz
  • DRP-AI AI accelerator supports vision AI up to 80 TOPS (sparse, skip zero weights)
  • Power efficiency of ~10 TOPS/W (Low-power, fanless operation)
  • 3D GPU (Mali-G31) supports OpenGL ES 3.2/3.1/3.0/2.0, Vulkan 1.2 and OpenCL 2.0 (Full Profile)
  • H.264(1920×1080@ 60fps)/H.265(3840×2160 @30fps) encode and decode
  • 16GB/8GB LPDDR4x, 128GB eMMC
  • 1 x 4-LANE MIPI-DSI up to 1920×1080 @ 60 Hz, 2x GBEs and 4 x 4-LANE MIPI-CSI
  • 2 x USB 3.2, 1 x 4-lane PCIe 3.0, 1 x USB 2.0 OTG and 1x USB2.0 host, 32x extra GPIOs
  • 2 x CAN-FD, 1 x SDIOs, 4 x UARTs, 6 x I2C, 2 x I2S, 1 x QSPI, 2 x SPI, 6 x PWMs, 2x ADCs

 

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OSM-RZV2H-LF Renesas OSM 1.2 size-L System-on-Module


  • Renesas RZ/V2H 4 x Cortex-A55 @1.8GHz, 2 x Cortex-R8 @800MHz and 1 x Cortex-M33 @200MHz
  • DRP-AI3 Accelerator up to 80 TOPS (sparse) enabling high throughput for vision AI tasks at the edge
  • 3D GPU (Mali-G31) supports OpenGL ES 3.2/3.1/3.0/2.0, Vulkan 1.2 and OpenCL 2.0 (Full Profile)
  • H.264(1920×1080@ 60fps)/H.265(3840×2160 @30fps) encode and decode
  • OSM 1.2 Size-L (45mm x 45mm) Compliance
  • Availability guaranteed until 2038

Feature Highlights


8GB or 16GB LPDDR4 and 128GB eMMC


1 x 4-LANE MIPI-DSI (1920 × 1200 pixels @ 60 Hz) and 4 x 4-LANE MIPI-CSI


2 x GbE LANs, 2 x USB 3.2, 1 x 4-lane PCIe 3.0, 1 x USB 2.0 OTG and 1x USB2.0 host, 32x extra GPIOs


2 x CAN-FD, 1 x SDIOs, 4 x UARTs, 6 x I2C, 2 x I2S, 1 x QSPI, 2 x SPIs, 6 x PWMs, 2x ADCs


Wide temperature range of -40 degree C to 85 degree C


Yocto Project, Ubuntu, Linux and RTOS


Full Board Support Package and ready-to-run images


Yocto Project, Ubuntu, and Android BSP


Continuous BSP updates and maintenance


Speed Up your Product Design


Full carrier-board design package - schematics, BOM, PCB layout, Library Symbol, CAD Symbol and 3D step files


Direct technical support by Embedian design engineers


Free design review by Embedian engineers


Carrier board debug by Embedian design engineers


Driver adaptation service for custom LCD panels

hardware document Specifications

Specifications

Technical Information

Compliance

OSM 1.2 Size-L Compliant

Dimension (W x L)

45mm x 45mm

CPU



Renesas RZ/V2H (R9A09G057H48GBG) 4 x Cortex-A55 @1.8GHz


2 x Cortex-R8 @800MHz for hard real-time processing


1 x Cortex-M33 @200Mhz for system management control

GPU


Arm Mali-G31


Support OpenGL ES 2.0/3.0/3.2, Vulkan 1.2 and OpenCL 2.0 (Full Profile)

AI  accelerator (DRP-AI)


DRP-AI (AI-MAC + DRP0)


Up to 80 TOPS (sparse, skip zero weights)


Up to 8 dense TOPS

Image Signal Processor Unit (ISP)


Arm Mali-C55


1 unit, supporting 4K


Maximum pixel rate: 630 Mpixels/s


Supports input formats: RAW8, 10, 12, 14, 16, 20


Supports output formats: YUV422, YUV420, RGB

Video Codec Unit


H.264/H.265 codec module


Support for encoding and decoding

– H.264/AVC (High Profile, level 4.2; Main Profile, level 4.2; Baseline Profile, level 4.2)

– H.265/HEVC (Main Profile, level 5)

– H.264/AVC (High Profile, level 4.2; Main Profile, level 4.2; Baseline Profile, level 4.2)

– H.265/HEVC (Main Profile, level 5)


Maximum size

– (H.264) 1920 × 1080 × 60 fps

– (H.265) 3840 × 2160p × 30 fps


I-/P-slice supported for H.264/H.265 encoding and ddecoding

Main Memory


32-bit 8GB/16GB LPDDR4x up to 2.133 GHz


128GB eMMC (5.x) onboard


M24C32 EEPROM onboard

Display


4-LANE MIPI DSI (up to 1920×1080 @ 60 Hz)

Camera Interface


4 x 2-lane MIPI-CSI

SDIO

One SDIO interface


1 x 4-bit SDIO card interface with support lines

SPI


One QSPI interface with two chip selects


Two SPI interfaces with two chip selects on each SPI channel

I2S

Two I2S interfaces


Typically used for connection to I2S audio CODECs

I2C

Six I2C interfaces

UART


Four asynchronous serial ports


Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).


Two ports supporting data-only signals (RXD, TXD).

FlexCAN Bus

Two CAN-FD interfaces


Logic level signals from Module based FlexCAN bus protocol controllers


RXD and TXD only

USB


Two USB 3.2 host with PHY


One USB OTG 2.0 Ports with PHY


One USB 2.0 Host with PHY

PCIe


PCIe Gen 3


Root complex or Endpoint selectable


Lane configuration selectable from below:

– 1, 2, or 4 lanes × 1 channel

– 1 or 2 lanes × 2 channels

Gigabit Ethernet


Two GbE MDI interfaces


PHY and magnetics are not on Module


LED support signals

Real-Time Clock (RTC)

External Micro Crystal RV-8263-C8 RTC controller on module

General Purpose I/O

24 x GPIO Signals

PWM


4 x PWMs

ADC


2 x ADCs

Power Consumption (Typical)

1.8 W

Boot Source Select

Select options include to boot from one of the following:


Module eMMC Flash (Default)


Carrier SD Card (Recovery)

Power Supply

Fixed 5V


5V +/- 5% power input voltage


1.8V VDDIO

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

OSM 1.2 Size-L

45 mm x 45 mm by OSM 1.1 Size-L Specification

hardware document Design Resources

[Download not found]
[Download not found]
 

hardware document Software Guides

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Ubuntu

Developer's Guide

Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems

OSM-RZV2H-LF Renesas OSM 1.2 Evaluation Kit


  • OSM-RZV2H-LF module bring-up platform for hardware and software development
  • OSM-RZV2H-LF module evaluation and validation platform
  • Customer carrier board design reference
  • Priority technical support from Embedian
  • Can serve as a single board computer (SBC) product.

Ordering Info.


Part Number: EVK-EDGE-RZV2H


Packing Lists


1 x EDGE-RZV2H SBC


1 x Heat Sink


1 x bootable micro-SD card with image pre-installed


1 x 12V/3.5A Power Supply


1 x pITX-IOB-2201 I/O expansion board


Evaluation Bseboard Features


DC +12V Power input with 2.5mm DC Jack


Supports all OSM-RZV2H-LF I/O interfaces


An additional 50-pin I/O Box Header and expansion board


Form factor: 100mm x 100mm x 21 mm

hardware document Ordering Information

Part Number

Notes

1


8G: 8GB LPDDR4x


16G: 16GB LPDDR4x

2. I: Industrial Temperature (-40 degree C ~ 85 degree C); Leave it blank if commercial temperature.

Examples


Part Number: OSM-RZV2H-LF-16G-I

Description: Renesas RZ/V2H OSM size-L 1.2 module with 16GB LPDDR4x, Industrial Temperature (-40 degree C ~ 85 degree C)


Part Number: OSM-RZV2H-LF-8G

Description: Renesas RZ/V2H OSM 1.2 size-L module with 8GB LPDDR4x and commercial temperature.)

Why choose Embedian?

NXP EBS Partner

TI Direct Account

A Culture of High Quality and Efficiency

Dedicated on ARM-Cortex Platform for 20 years