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SMARC-iMX8MQ

$165

  • NXP i.MX8M 4 x Cortex-A53 @1,5 GHz
  • 2 GB/4 GB LPDDR4, 16 GB eMMC
  • HDMI/DP, LVDS, 1x GBE, 2x MIPI-CSI
  • 2x CAN, 4x UART, 5x I2C, 2x I2S, 2x PCIe, 2x SPI, 2x USB3.0, 1x USB2.0 OTG och 4x USB2.0

 

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SKU: SMARC-iMX8M-Q-2G Categories: Tag:

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SMARC-iMX8M NXP SMARC 2.0 System-on-Module

  • Quad-/Dual-core ARM Cortex-A53, 1,5 GHz
  • Realtids-ARM Cortex-M4-koprocessor, 266 MHz
  • SMARC 2.0-kompatibel (82 mm × 50 mm)
  • Tillgänglighet garanterad till 2038

Höjdpunkter


2 GB eller 4 GB LPDDR4 samt 16 GB eMMC


HDMI 2.0a-/DP-port med upplösning upp till 4Kp60, 24-bitars dubbelkanals LVDS (1080p) samt 2 × MIPI-CSI (2-LANE och 4-LANE)


GPU (OpenGL ES 3.1, OpenCL 1.2, OpenGL 3.0, OpenVG och Vulkan)


VPU (4Kp60 (H.265, VP9), 4Kp30 (H.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, H.263, DivX), MJPEG)


1 × GbE med AVB, 2 × USB 3.0, 1 × USB OTG, 4 × USB 2.0, 2 × CAN, 4 × UART, 5 × I2C, 2 × I2S, 2 × PCIe 2.1 (1-LANE), 2 × SPI, 1 × SDIO, 12 × GPIO


Brett temperaturområde: -40 °C till 85 °C

Yocto Project, Ubuntu, Debian, Android, Linux och RTOS


Fullständigt Board Support Package (BSP) med körklara avbilder


BSP för Yocto Project, Ubuntu, Debian och Android


Kontinuerliga uppdateringar och underhåll av BSP

Snabba upp din produktdesign


Fullständigt designpaket för bärare: scheman, komponentlista (BOM), PCB-layout och 3D STEP-filer


Direkt teknisk support från Embedians designingenjörer


Gratis designgranskning av Embedians ingenjörer


Felsökning av bärare utförd av Embedians designingenjörer


Drivaranpassning för anpassade LCD-paneler

hardware document Specifikationer

Specifications


Technical Information

Compliance

SMARC 2.0 Compliant

Dimension (W x L)

82mm x 50mm

CPU

  • NXP i.MX8M 4/2 x Cortex-A53 @1.5GHz

  • Real-time 266MHz ARM Cortex-M4

GPU

  • GC7000 Lite (3D)

  • OpenGL ES 3.1, OpenGL 3.0, Vulkan, Open CL 1.2

  • Up to 4Kp60 resolutions

VPU

  • Video Decode: 4Kp60 (h.265, VP9), 4Kp30 (h.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, h.263, DiVX), MJPEG

Main Memory

  • 32-bit 2GB/4GB LPDDR4 up to 3200MT/s

  • 16GB eMMC (5.x) onboard

  • AT24C32 EEPROM onboard

Display

  • HDMI 2.0a (up to 4Kp30)

  • Dual Channel LVDS display (up to 1920x1200@60Hz, interface vis MIPI-DSI by TI SN65DSI84 bridge)

Camera Interface

  • 1 x 2-lane and 1 x 4-lane MIPI-CSI

SDIO

One SDIO interface

  • 1 x 4-bit SDIO card interface with support lines

SPI

Two SPI interfaces with two chip selects per SPI channel.

I2S

Two I2S interfaces

  • Typically used for connection to I2S audio CODECs

I2C

Six I2C interfaces

  • Power Management

  • General Purpose

  • Camera 0

  • Camara 1

  • LCD Display ID

  • HDMI

UART


  • Four asynchronous serial ports

  • Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).

  • Two ports supporting data-only signals (RXD, TXD).

CAN Bus

Two CAN 2.0b interfaces (via Microchip MCP2515 SPI to CAN bridge)

  • Logic level signals from Module based CAN bus protocol controllers

  • RXD and TXD only

  • Maxmium baud rate at 250k without package loss.

USB

  • One USB OTG 2.0 Ports with PHY

  • Four USB 2.0 Host with PHY

  • Two USB 3.0 Host with PHY

PCIe

  • Two PCIe 2.1 (1-lane)

  • Common PCIe wake signal

Gigabit Ethernet

  • One GbE MDI interfaces

  • Realtek RTL-8211FD-CG PHY on module

  • No magnetics on Module

  • LED support signals

Real-Time Clock (RTC)

External Seiko S35390A controller on module

General Purpose I/O

12 x GPIO Signals, specific alternate functions are assigned to some GPIOs

  • PWM / Tachometer capability

  • Camera support

  • CAN Error Signaling

  • HD Audio reset

System and Power Management Signals

  • Reset Out and Reset In 

  • Power Button Input

  • Power Source Sataus

  • Module Power State Status

  • System Management Pins

  • Battery and Battery 

  • Charger Management Pins

  • Carrier Power On Control Pins

Power Consumption

  • 3.6W (Typical)

  • 5.3W (Max)

Heat Sink

VTT-HS-8J066

  • Note: i.MX8MQ needs heat sink

Boot Source Select

Three pins to allow selection from carrier board. Select options include to boot from one of the following:

  • Module eMMC Flash (Default)

  • Network Boot

  • Carrier SD Card (Recovery)

Power Supply

3V to 5.25V

Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply

  • 1.8V VDDIO

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

SMARC 2.0

82 mm x 50 mm by SMARC 2.0 Specification

hardware document Designresurser

 

hardware document Mjukvaruguider

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Debian

Developer's Guide

Comprehensive Debian developer guide for building, customizing embedded Linux systems

Ubuntu

Developer's Guide

Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems

Android

Developer's Guide

Comprehensive Android developer guide for building, customizing embedded Linux systems

SMARC-iMX8M NXP SMARC 2.0 System-on-Module

  • Uppfyller SMARC v2.0+-modulstandard
  • SMARC v2.0+-modul för uppstartsplattform för hårdvaru- och mjukvaruutveckling
  • Utvärderings- och valideringsplattform för SMARC 2.0+-moduler
  • Referensdesign för kundens carrier board
  • Prioriterad teknisk support från Embedian

Ordering Info.


Part Number: EVK-STD-CARRIER-S20

Packing Lists


1 x EVK-STD-CARRIER-S20 carrier board


4 x M2.5 screws


1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)


1 x LVDS cable


1 x LVDS LCD Backlight cable


1 x 12V/3.5A Power Supply


1 x SATA Power cable


1 x 10-way box header to DB9 cable (for console or RS232)


SMARC module not included)

Evaluation Bseboard Features


DC +12V ~ +24V Power input with 2.5mm DC Jack


Accept 1.8V VDDIO SMARC 2.0+ compliant module


Supports all SMARC 2.0+ I/O interfaces


Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

hardware document Beställningsinformation

Part Number

Notes

1.

  • Q: Quad Core Cortex-A53

  • L: Quad Lite Core Cortex-A53 (No VPU)

  • D: Dual Core Cortex-A53

2.

  • 2GB: 2GB LPDDR4 memory

  • 4GB: 4GB LPDDR4 memory (only quad core support 4GB)

3.

  • I: Industrial Temperature (-40 degree C ~ 85 degree C); Only industrial temperature option for this part.

4.

  • C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Example

  • Part Number: SMARC-iMX8M-Q-4G-I

Description: Quad core Cortex-A53 i.MX8M processor SMARC 2.0 module with 4GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)

  • Part Number: SMARC-iMX8M-Q-2G

Description: Quad core Cortex-A53 i.MX8M processor SMARC 2.0 module with 2GB LPDDR4, Commercial Temperature (0 degree C ~ 60 degree C)

Optional Accessaries

Heat Sink

  • P/N: VTT-HS-8J066

Description: Heak sink for SMARC-iMX8M

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