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ARM Cortex Computing Platform

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SMARC-iMX8MP

Highlight

  • NXP i.MX8M Plus 4 x 1.8GHz ARM Cortex-A53 and 1 x 800Mhz Cortex-M7
  • 2GB/4GB/6GB LPDDR4, 16GB eMMC Flash, 1x SDIO
  • 24-bit dual-channeled LVDS, HDMI 2.0a, MIPI DSI
  • 2 x GBE LAN (one w/TSN)
  • 2 x CAN-FD, 4 x UART, 6 x I2C, 2 x I2S, 1 x PCIe3 , 12 x GPIOs, 2 x SPI, 4-LANE and 2-LANE MIPI-CSI, 5 x USB2.0, 1 x USB 3.0

Possible Applications

  • eCockpit
  • Motorcycle Engine Control Unit
  • Medical Imaging
  • Smart Home Robotic Appliance
  • Avionics
  • Electricity Generation
  • Energy Gateway
  • Automatic Vehicle Identification
  • Motion Control and Robotics
  • 3-Phase AC Induction Motor

SMARC LOGOFreescale LOGOYocto Project LOGO
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Please Choose:

SMARC-iMX8MP-Q-2G




SMARC-iMX8MP-Q-4G




SMARC-iMX8MP-Q-2G-I




SMARC-iMX8MP-Q-4G-I




SMARC-iMX8MP-Q-2G-I-C




SMARC-iMX8MP-Q-4G-I-C





The SMARC-iMX8MP enables system integrators and manufacturers to create and deploy advanced and power-efficient solutions at the edge. It provides high performance and processing speed, while keeping the power consumption to a minimum.
Based on NXP i.MX8M Plus quad and dual cores, the SMARC-iMX8MP carries quad/dual 1.8GHz ARM Cortex-A53 and 800MHz real-time Cortex-M7 co-processor. The built-in NPU (up to 2.3TOPs) provides customers the option to perform machine learning inference directly on the edge, reducing cloud dependency, latency and is able to perform highly complex neural network functions like face and emotion detection, object detection and surveillance, which are key to applications such as smart and safe cities, retail, smart home and much more.
Featuring additional high-speed interfaces such as 2 x Gigabit Ethernet (one with TSN), PCIe Gen 3, USB 3.0, LVDS, HDMI, MIPI-DSI and CAN-FD capabilities, offering industrial temperature grade and NXP's longevity program, the i.MX8M Plus SMARC 2.0 module is perfect for industrial IoT and HMI applications.


Technical Information
Part Number
SMARC-iMX8MP part number
  • 1: Q (CPU is Quad Core Cortex-A53 with NPU)
        D (CPU is Dual Core Cortex-A53 with NPU)
  • 2: 2G (2GB LPDDR4 memory up to 4000MT/s)
        4G (4GB LPDDR4 memory up to 4000MT/s)
        6G (6GB LPDDR4 memory up to 4000MT/s)
  • 3: I: Industrial temperature (-40oC ~ 85oC); Leave it Blank if you do not need it.
Note: SMARC-iMX8MP supports 1.8V (SMARC 2.0) VDDIO.
Example: SMARC-iMX8MP-Q-4G stands for Quad core i.MX8M Plus processor with NPU and 4GB LPDDR4 memory in normal operating temperature.
Compliance
SMARC 2.0 Compliant
Dimension (W x L)
82mm x 50mm
CPU
NXP i.MX8M Plus 4/2 x 1.8GHz CortexTM-A53
1x 800Mhz CortexTM-M7
512KB L2 Cace
Main Memory
4GB/6GB LPDDR4 up to 4000MT/s
16GB eMMC (5.x) onboard
AT24C32 EEPROM onboard
Graphic Process Unit (GPU)
GC7000UL with OpenCL and Vulkan support
2 shaders
166 million triangles/sec
Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2, Vulkan
GC520L for 2D acceleration
Render target compatibility between 3D and 2D GPU (super tile status buffer)
Video Processing Unit (VPU)
1080p60 HEVC/H.265 Main, Main 10 (up to level 5.1) decoder
1080p60 VP9 Profile 0, 2 decoder
1080p60 VP8 decoder
1080p60 AVC/H.264 Baseline, Main, High decoder
1080p60 AVC/H.264 encoder
1080p60 HEVC/H.265 encoder
Neural Processing Unit (NPU)
2.3 TOP/s Neural Network performance
Keyword detect, noise reduction, beamforming
Speech recognition (i.e. Deep Speech 2)
Image recognition (i.e. ResNet-50)
Display Interfaces
HDMI 2.0a (up to 3840x2160p30)
Dual channel LVDS display (up to 1920x1200p60)
MIPI DSI (up to 1920x1440p60)
TPM
Support TPM 2.0
MIPI-CSI Camera Interfaces
1x MIPI-CSI x4 and 1x MIPI-CSI x2
SDIO Interfaces
One SDIO interfaces
  • 4 bit SDIO card interface with support lines
  • 8 bit eMMC interface with support lines
SPI Interfaces
Two SPI interfaces with 2 chip selects on each SPI channel
I2S Interfaces
Two I2S interfaces
  • Typically used for connection to I2S audio CODECs
I2C Interfaces
Six I2C interfaces
  • Power Management
  • General Purpose
  • Camera0
  • Camera1
  • LCD Display ID
  • HDMI
Asynchronous Serial Port (UART) Interfaces
Four asynchronous serial ports
Two with 4 wire handshake (RXD, TXD, RTS#, CTS#)
Two with data only (RXD, TXD)
Logic level signals
FlexCAN Bus Interfaces
Two CAN-FD interfaces (industrial temp. variant) or two CAN 2.0b interfaces (commercial temp. variant)
  • Logic level signals from Module based FlexCAN bus protocol controllers
  • RXD, TXD only
USB Interfaces
One USB OTG 2.0 Ports with PHY
Five USB 2.0 Host Ports with PHY
Two USB 3.0 Host Ports with PHY
USB support signals (VBUS enable / Over-current detects, OTG support signals)
PCI Express
One PCIe 3.0 1-Lane
PCIe Gen3.0
Could be configured as PCIe target
Common PCIe wake signal
Gigabit Ethernet (one supports QoS with TSN)
Two analog GBE MDI interfaces (Realtek RTL-8211FD-CG PHY on module)
No magnetics on Module
LED support signals
Watchdog Timer Interfaces
Real-Time Clock
External Seiko S35390A onboard
General Purpose I/O
Twelve GPIO signals
Specific alternate functions are assigned to some GPIOs
PWM / Tachometer capability
Camera support
CAN Error Signaling
HD Audio reset
System and Power Management Signals
Reset out and Reset in
Power button in
Power source status
Module power state status
System management pins
Battery and battery charger management pins
Carrier Power On control
Power Consumption (Typical)
Quad Core (4GB LPDDR4): TBD
Dual Core (4GB LPDDR4): TBD
Boot Source Select
Three pins to allow selection from Carrier Board
Select options to include boot from one of the following:
  • Module eMMC Flash (Default)
  • Module Remote Boot (Network Port)
  • Module eMMC Boot
  • Carrier SD Card

Power Supply
3V to 5.25V:
Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply

Heat Sink Solution
Heat Sink:
Note: The heat sink is a MUST for this product.

Software
Linux and Android:
Based on NXP imx_5.10.9_1.0.0
Yocto Project Support
Debian 11 Bullseye Support
Android 11.0.0_2.0.0

Temperature
Industrial Temperature
Operating Temperature Range: -45o C ~ 85o C
Storage Temperature Range: -40o C ~ 150o C
Junction Temperature Range: -40o C ~ 150o C

Form Factor
SMARC 2.0:
82 mm x 50 mm by SMARC 2.0 Specification

Evaluation Baseboard (EVK-STD-CARRIER-S20)
Features:
12V~24V Power input with 2.5mm DC Jack connector
3.5mm Audio Jack (SGTL5000 Audio Codec on Carrier)
RTC backup battery holder
Buzzer
LVDS, Display Port (DP)) and HDMI connector
2 x 10/100/1000Mbps RJ-45 connector
2 x RS232/422/485 DSUB9 connector, 2 x RS232 2.0mm Header
2 x USB host 2.0 type A connectors, 2 x USB host 3.0 type A connectors, 1 x mini USB client connector
1 x PCIex4 connector, 2 x mini PCIe connector
2 x CAN BUS header, 1 x 2x7-pin GPIO header, Audio Mic. in and Speaker out Audio Jack
2 x I2C header (for capacitive touch), 4 x SPI header, 1 Camera/MIPI header
1 x SDHC connector
A single 4KB EEPROM is provided on I2C0 that holds the board information. This information includes board name, serial number, and revision information.
1 x external watchdog reset
jumpers for LCD 3.3V or 5V voltage, boot selection, RS232 or RS485 selection
Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)
Your IP Address is: 216.73.216.115