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NXP i.MX8M PLUS 4 x Cortex-A53 @1.8GHz
Real-time 800MHz ARM Cortex-M7
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GC7000 Ultra Lite (3D) and GC520L (2D)
Supports OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2 FP, OpenVG 1.1 and G2D
Supports upto 4Kp30 resolutions
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Video Decode: 1080p60, h.265/4, VP9, VP8
Video Encode: 1080p60, h.265/4
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2.3 TOP/s Neural Network performance
Keyword detect, noise reduction, beamforming
Speech recognition (i.e. Deep Speech 2)
Image recognition (i.e. ResNet-50)
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32-bit 2GB/4GB/6GB LPDDR4 up to 3200MT/s
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Dual Channel LVDS display (up to 1920x1200@60Hz)
MIPI DSI (up to 1920x1440p60)
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1 x 2-lane and 1 x 4-lane MIPI-CSI
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1 x 4-bit SDIO card interface with support lines
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| Two SPI interfaces with two chip selects per SPI channel. |
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Typically used for connection to I2S audio CODECs
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1 x PCIe Gen 3.0 (1-lane)
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Four asynchronous serial ports
Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).
Two ports supporting data-only signals (RXD, TXD).
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Logic level signals from Module based FlexCAN bus protocol controllers
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One USB OTG 2.0 Ports with PHY
Four USB 2.0 Host with PHY
Two USB 3.0 Host with PHY
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Realtek RTL-8211FD-CG PHY on module
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| External Seiko S35390A controller on module |
| 12 x GPIO Signals, specific alternate functions are assigned to some GPIOs
PWM / Tachometer capability
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System and Power Management Signals |
Module Power State Status
Battery and Battery Charger Management Pins
Carrier Power On Control Pins
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Note: i.MX8M Plus needs heat sink
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| Three pins to allow selection from carrier board. Select options include to boot from one of the following:
Module eMMC Flash (Default)
Carrier SD Card (Recovery)
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| Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply
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Industrial Temperature Range | -40 degree C ~ 85 degree C |
Commercial Temperature Range | |
Storage Temperature Range | -40 degree C ~ 150 degree C |
Junction Temperature Range | -40 degree C ~ 150 degree C |
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| 82 mm x 50 mm by SMARC 2.1 Specification |