SMARC-iMX8MQ

Aperçu

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

ARM Cortex-A53 quadricœur / bicœur, 1,5 GHz
Coprocesseur temps réel ARM Cortex-M4, 266 MHz
Conforme à la norme SMARC 2.0 (82 mm × 50 mm)
Disponibilité garantie jusqu’en 2038

Points forts
2 Go ou 4 Go de LPDDR4 et 16 Go d’eMMC Résolution des ports HDMI 2.0a / DP jusqu’à 4Kp60, LVDS double canal 24 bits (1080p) et 2 × MIPI-CSI (2-LANE et 4-LANE) GPU (OpenGL ES 3.1, OpenCL 1.2, OpenGL 3.0, OpenVG et Vulkan) VPU (4Kp60 (H.265, VP9), 4Kp30 (H.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, H.263, DivX), MJPEG) 1 × GbE avec AVB, 2 × USB 3.0, 1 × USB OTG, 4 × USB 2.0, 2 × CAN, 4 × UART, 5 × I2C, 2 × I2S, 2 × PCIe 2.1 (1 voie), 2 × SPI, 1 × SDIO, 12 × GPIO Large plage de températures : de -40 °C à 85 °C

Yocto Project, Ubuntu, Debian, Android, Linux et RTOS
Paquet de prise en charge complète de la carte (BSP) avec images prêtes à l’emploi BSP Yocto Project, Ubuntu, Debian et Android Mises à jour et maintenance continues du BSP

Accélérez la conception de votre produit
Pack complet de conception de carte porteuse – schémas, nomenclature (BOM), disposition PCB et fichiers 3D STEP Support technique direct par les ingénieurs de conception Embedian Revue de conception gratuite par les ingénieurs Embedian Débogage de la carte porteuse par les ingénieurs de conception Embedian Service d’adaptation de pilotes pour panneaux LCD personnalisés

Spécifications

Specifications
Technical Information
Compliance	SMARC 2.0 Compliant
Dimension (W x L)	82mm x 50mm
CPU	NXP i.MX8M 4/2 x Cortex-A53 @1.5GHz Real-time 266MHz ARM Cortex-M4
GPU	GC7000 Lite (3D) OpenGL ES 3.1, OpenGL 3.0, Vulkan, Open CL 1.2 Up to 4Kp60 resolutions
VPU	Video Decode: 4Kp60 (h.265, VP9), 4Kp30 (h.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, h.263, DiVX), MJPEG
Main Memory	32-bit 2GB/4GB LPDDR4 up to 3200MT/s 16GB eMMC (5.x) onboard AT24C32 EEPROM onboard
Display	HDMI 2.0a (up to 4Kp30) Dual Channel LVDS display (up to 1920x1200@60Hz, interface vis MIPI-DSI by TI SN65DSI84 bridge)
Camera Interface	1 x 2-lane and 1 x 4-lane MIPI-CSI
SDIO	One SDIO interface 1 x 4-bit SDIO card interface with support lines
SPI	Two SPI interfaces with two chip selects per SPI channel.
I2S	Two I2S interfaces Typically used for connection to I2S audio CODECs
I2C	Six I2C interfaces Power Management General Purpose Camera 0 Camara 1 LCD Display ID HDMI
UART	Four asynchronous serial ports Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#). Two ports supporting data-only signals (RXD, TXD).
CAN Bus	Two CAN 2.0b interfaces (via Microchip MCP2515 SPI to CAN bridge) Logic level signals from Module based CAN bus protocol controllers RXD and TXD only Maxmium baud rate at 250k without package loss.
USB	One USB OTG 2.0 Ports with PHY Four USB 2.0 Host with PHY Two USB 3.0 Host with PHY
PCIe	Two PCIe 2.1 (1-lane) Common PCIe wake signal
Gigabit Ethernet	One GbE MDI interfaces Realtek RTL-8211FD-CG PHY on module No magnetics on Module LED support signals
Real-Time Clock (RTC)	External Seiko S35390A controller on module
General Purpose I/O	12 x GPIO Signals, specific alternate functions are assigned to some GPIOs PWM / Tachometer capability Camera support CAN Error Signaling HD Audio reset
System and Power Management Signals	Reset Out and Reset In Power Button Input Power Source Sataus Module Power State Status System Management Pins Battery and Battery Charger Management Pins Carrier Power On Control Pins
Power Consumption	3.6W (Typical) 5.3W (Max)
Heat Sink	VTT-HS-8J066 Note: i.MX8MQ needs heat sink
Boot Source Select	Three pins to allow selection from carrier board. Select options include to boot from one of the following: Module eMMC Flash (Default) Network Boot Carrier SD Card (Recovery)
Power Supply
3V to 5.25V	Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply 1.8V VDDIO
Temperature
Industrial Temperature Range	-40 degree C ~ 85 degree C
Commercial Temperature Range	0 degree C ~ 60 degree C
Storage Temperature Range	-40 degree C ~ 150 degree C
Junction Temperature Range	-40 degree C ~ 150 degree C
Form Factor
SMARC 2.0	82 mm x 50 mm by SMARC 2.0 Specification

Ressources de conception

Guides logiciels

Yocto Developer's Guide label Comprehensive Yocto developer guide for building, customizing embedded Linux systems Scarthgap Yocto Scarthgap (Kernel 6.6.52) Mickledore Yocto Mickledore (Kernel 6.1.55) Kirkstone Yocto Kirkstone (Kernel 5.15.71) All Release All SMARC-iMX8 Yocto Release	Debian Developer's Guide label Comprehensive Debian developer guide for building, customizing embedded Linux systems Debian 12 Bookworm Debian Bullseye (Kernel 6.6.52) Debian 11 Bullseye Debian Bookworm (Kernel 5.10.9) All Release All Debian Release	Ubuntu Developer's Guide label Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems Ubuntu 22.04 Ubuntu 22.04(Kernel 6.1.55) All Release All Ubuntu Release	Android Developer's Guide label Comprehensive Android developer guide for building, customizing embedded Linux systems Android 15 Android 15(Kernel 6.6.58) Android 11 Android 11(Kernel 5.10.9) All Release All Android Release

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

Conformité au module SMARC v2.0+
Plateforme de mise en service SMARC v2.0+ pour le développement matériel et logiciel
Plateforme d’évaluation et de validation du module SMARC 2.0+
Référence de conception de carte porteuse client
Support technique prioritaire fourni par Embedian

Ordering Info.
Part Number: EVK-STD-CARRIER-S20

Packing Lists
1 x EVK-STD-CARRIER-S20 carrier board 4 x M2.5 screws 1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules) 1 x LVDS cable 1 x LVDS LCD Backlight cable 1 x 12V/3.5A Power Supply 1 x SATA Power cable 1 x 10-way box header to DB9 cable (for console or RS232) SMARC module not included)

Evaluation Bseboard Features
DC +12V ~ +24V Power input with 2.5mm DC Jack Accept 1.8V VDDIO SMARC 2.0+ compliant module Supports all SMARC 2.0+ I/O interfaces Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

Informations de commande

Notes
1.	Q: Quad Core Cortex-A53 L: Quad Lite Core Cortex-A53 (No VPU) D: Dual Core Cortex-A53
2.	2GB: 2GB LPDDR4 memory 4GB: 4GB LPDDR4 memory (only quad core support 4GB)
3.	I: Industrial Temperature (-40 degree C ~ 85 degree C); Only industrial temperature option for this part.
4.	C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.
Example
Part Number: *SMARC-iMX8M-Q-4G-I* Description: Quad core Cortex-A53 i.MX8M processor SMARC 2.0 module with 4GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)
Part Number: *SMARC-iMX8M-Q-2G* Description: Quad core Cortex-A53 i.MX8M processor SMARC 2.0 module with 2GB LPDDR4, Commercial Temperature (0 degree C ~ 60 degree C)
Optional Accessaries
Heat Sink
P/N: VTT-HS-8J066
Description: Heak sink for SMARC-iMX8M

Partager :

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

Spécifications

Ressources de conception

Guides logiciels

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

Informations de commande

Pourquoi choisir Embedian ?

Partenaire EBS de NXP

Compte Direct TI

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20 ans d’expertise sur la plateforme ARM Cortex

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SMARC-iMX8MQ

Partager :

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

Spécifications

Ressources de conception

Guides logiciels

SMARC-iMX8M NXP SMARC 2.0 Module sur Système (SoM)

Informations de commande

Pourquoi choisir Embedian ?

Partenaire EBS de NXP

Compte Direct TI

Une culture de haute qualité et d’efficacité

20 ans d’expertise sur la plateforme ARM Cortex