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EDGE-RZV2H

Price range: $399 through $499

  • High throughput AI inference at the edge (up to ~80 TOPS) that can handle complex vision models (e.g., image classification, detection) locally
  • Renesa RZ/V2H 4 x Cortex-A55 @1.8GHz, 2 x Cortex-R8 @800MHz and 1 x Cortex-M33 @200MHz
  • DRP-AI AI accelerator supports vision AI up to 80 TOPS (sparse, skip zero weights)
  • Power efficiency of ~10 TOPS/W (Low-power, fanless operation)
  • 3D GPU (Mali-G31) supports OpenGL ES 3.2/3.1/3.0/2.0, Vulkan 1.2 and OpenCL 2.0 (Full Profile)
  • H.264(1920×1080@ 60fps)/H.265(3840×2160 @30fps) encode and decode
  • 8GB/16GB LPDDR4x, 128GB eMMC
  • HDMI, 1 x M.2 key-E (PCIe 3.0/UART/USB2.0 for WLAN), 1 x M.2 Key-B (I2S/USB2.0/USB3.2 for 4G/5G LTE), 1 x USB 2.0 OTG, 2 x USB 3.2 host, 2 x SPIs, 2x GBEs LANs and 4 x MIPI-CSI
  • 2.00mm 50P expansion header (1 x USB 3.2 Host, 2x USB 2.0 Host, 2x CAN-FD (TTL), 2x UARTs, 2x I2C, 1x SPI and 6x GPIOs)

 

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SKU: EDGE-RZV2H-16G-I Category: Tag:

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EDGE-RZV2H RZ/V2H SBC

  • Renesa RZ/V2H 4 x Cortex-A55 @1.8GHz, 2 x Cortex-R8 @800MHz and 1 x Cortex-M33 @200MHz
  • DRP-AI AI accelerator supports vision AI up to 80 TOPS (sparse, skip zero weights)
  • 3D GPU (Mali-G31) supports OpenGL ES 3.2/3.1/3.0/2.0, Vulkan 1.2 and OpenCL 2.0 (Full Profile)
  • H.264(1920×1080@ 60fps)/H.265(3840×2160 @30fps) encode and decode
  • Dimension: 100mm x 100mm and passive cooling solution
  • Availability guaranteed until 2038

Feature Highlights


8GB or 16GB LPDDR4 and 128GB eMMC


HDMI (from MIPI-DSI to HDMI bridge) connector


HDMI (from MIPI-DSI to HDMI bridge) connector


1 x M.2 (PCIe3.0/UART/USB2.0) Key E connector (for WIFI)


1 x M.2 (I2S/USB2.0/USB3.2) Key B connector (for 4G/5G LTE)


2 x GbE RJ-45 connector


2 x USB 3.2 Type A, 1 x mini USB client mini-B connector


2 x SPI headers


1 x 50-pin expansion Header (2 x UARTs, 2 x CAN-FD, 1 x SPI, 2 x I2C, 6 x GPIOs, 1 x USB 3.2 and 2 x USB 2.0)


1 x power indication LED and 1 x Programmable LED


1 x reset button


Wide temperature range of -40 degree C to 85 degree C

Yocto Project, Ubuntu, Linux and RTOS


Full Board Support Package and ready-to-run images


Yocto Project, Ubuntu, and Android BSP


Continuous BSP updates and maintenance

Speed Up your Product Design


Full design package - BSP and 3D step files


Direct technical support by Embedian design engineers


Free design review by Embedian engineers


Carrier board debug by Embedian design engineers


Driver adaptation service for custom LCD panels

hardware document Specifications

Specifications

Technical Information

Dimension (W x L x H)

100mm x 100mm x 21mm

CPU


Renesas RZ/V2H (R9A09G057H48GBG) 4 x Cortex-A55 @1.8GHz


2 x Cortex-R8 @800MHz for hard real-time processing


1 x Cortex-M33 @200Mhz for system management control

GPU


Arm Mali-G31


Support OpenGL ES 2.0/3.0/3.2, Vulkan 1.2 and OpenCL 2.0 (Full Profile)

AI  accelerator (DRP-AI)


DRP-AI (AI-MAC + DRP0)


Up to 80 TOPS (sparse, skip zero weights)


Up to 8 dense TOPS

Image Signal Processor Unit (ISP)


Arm Mali-C55


1 unit, supporting 4K


Maximum pixel rate: 630 Mpixels/s


Supports input formats: RAW8, 10, 12, 14, 16, 20


Supports output formats: YUV422, YUV420, RGB

Video Codec Unit


H.264/H.265 codec module


Support for encoding and decoding


Support for encoding and decoding

– H.264/AVC (High Profile, level 4.2; Main Profile, level 4.2; Baseline Profile, level 4.2)

– H.265/HEVC (Main Profile, level 5)
 Maximum size


Maximum size

– (H.264) 1920 × 1080 × 60 fps

– (H.265) 3840 × 2160p × 30 fps
I-/P-slice supported for H.264


I-/P-slice supported for H.264/H.265 encoding and ddecoding1

Main Memory


32-bit 8GB/16GB LPDDR4x up to 2.133 GHz


128GB eMMC (5.x) onboard


M24C32 EEPROM onboard

Display


HDMI (up to 1920x1080p60) Connector


implement via LT9611UXC MIPI-DSI to HDMI bdrige

Gigabit Ethernet


2 x RJ45 connector along the board edge


Renesas RZ/V2H integrated two RGMIIs


Speed: 10/100/1000 Mbps


PHY: Realtek RTL8211FD(I)-CG

USB


Two USB 3.2 Host Connector (Type A) on the board edge


One USB 2.0 host signal set on the M.2 2230 Key E connector


One USB 3.2 and USB 2.0 host signal set on the M.2 2230 Key B connector


Two USB 2.0 and USB 3.2 Host signals set on the EIO 50-pin 2.0mm expansion box header

Camera Interface


4 x 4-lane MIPI-CSI


0.5mm 22P FPC(V) Connector on the rear side

SD interface


one 4-bit push-push microSD connector

SIM card interface


one push-push nanoSIM connector

SPI

Two SPI interfaces with two chip selects per SPI channel.


One SPI interfaces on the EIO 50‑pin 2.0 mm expansion box header


Two SPI on two 1x6P 2.00mm headers (one cs# each)

LED


1 x green power indication LED


1 x yellow programmable LED

M.2 Type 2230 Key E Connector

One M.2 Type 2230 Key E Connector


Support 1 x USB 2.0 signals


Support 1 x 4-wire UARTs


Support 1 x PCI 2.0 signals

M.2 Type 3052 Key B Connector

One M.2 Type 3052 Key B Connector


Support 1 x USB 3.2 signals


Support 1 x USB 2.0 signals


Support 1 x I2S signals

UART

Four UARTS


1 x 2-wire on debug header


1 x 4-wire on M.2 Connector


1 × 4‑wire and 1 × 2‑wire interfaces on the EIO 50‑pin 2.0 mm expansion box header

RTC


Backup Battery by 2-pin type connector


External Micro Crystal RV-8263-C8 RTC controller

Reset


1 Reset ButtonOne USB OTG 2.0 Ports with PHY

Rear I/O Expansion Header

EIO50 50-pin 2.00mm Box Header that includes


2 x USB 2.0 Host


1 x USB 3.0 Host


2 x CAN-FD (TTL)


1 x SPI


2 x I2C


2 x UARTs (1 x 4-wire and 1 x 2-wire)


6 x GPIOs

General Purpose I/O


5 x GPIOs on 10 pos 1mm header


6 x GPIOs on EIO 50-pin box header

Boot Source Select

Select options include to boot from one of the following:


eMMC Flash (Default)


microSD Card (Recovery)

Power Supply

12V input


Power Supply Voltage: 12V DC-IN by lockable DC Jack (or 2-pin type connector by BOM option)


AT or ATX mode


Power Consumption: 6.5 W

Expansion


1 x M.2 2230 Key E Slot (USB 2.0/UART/PCIe 3.0)


1 x M.2 3052 Key B Slot (USB 2.0/USB3.2/I2S)


1 x M.2 3052 Key B Slot (USB 2.0/USB3.2/I2S)


EIO50 50-pin 2.00mm Box Header (2 x UARTs, 2 x USB 2.0, 1 x USB 3.0, 2 x I2C, 1 x SPI, 6 GPIOs, 2 x CAN-FD)


SD Socket: 1 x Micro SD Socket

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

Dimension


Dimensions: 100 x 100 x 21 mm


Weight: 0.3kg

Certifications

CE/FCC class B

 

hardware document Software Guides

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Ubuntu

Developer's Guide

Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems

hardware document Ordering Information

Part Number

Notes

1


8G: 8GB LPDDR4x


16G: 16GB LPDDR4x

2. I: Industrial Temperature (-40 degree C ~ 85 degree C); Leave it blank if commercial temperature.

Examples


Part Number: EDGE-RZV2H-16G-I

Description: Renesas RZ/V2H SBC with 16GB LPDDR4x and Industrial Temperature (-40 degree C ~ 85 degree C)


Part Number: EDGE-RZV2H-8G

Description: Renesas RZ/V2H SBC with 8GB LPDDR4x, and commercial temperature.

Optional Accessories

50-P I/O Expansion Board: P/N: pITX-IOB-2201

Features


1 x USB 3.0+2.0 dual-stack Type A connector


1 x USB 2.0 Type A Connector


1 x SPI Header


3 x RS232, 1 x RS485


2 x CAN-FD (w/ transceiver)


6 x GPIO (-24V-24V)


2 x 2-pin I2C 2.0mm Header


Capacitity Touch RST and INT Header


Dimension: 146mm x 31mm

Packing List


1 x EDGE-RZV2H SBC


1 x RTC backup battery

Why choose Embedian?

NXP EBS Partner

TI Direct Account

A Culture of High Quality and Efficiency

Dedicated on ARM-Cortex Platform for 20 years