SMARC-iMX8MP

SMARC-iMX8MP NXP SMARC 2.1 System-on-Module

Quad-/Dual-Core ARM Cortex-A53, 1,8 GHz
Echtzeit ARM Cortex-M7 Co-Prozessor, 800 MHz
Integrierte 2,3 TOPS AI/ML Neural Processing Unit
SMARC 2.1 (82mm x 50mm) konform
Verfügbarkeit garantiert bis 2038

Funktions-Highlights
2 GB, 4 GB oder 6 GB LPDDR4 sowie 16 GB eMMC Integrierte AI/ML-Neural Processing Unit (2,3 TOPs) HDMI (4Kp30), 24-Bit Dual-Channel LVDS (1080p), MIPI-DSI (1920×1440p60) und 2 × MIPI-CSI (2-Lane und 4-Lane) GPU (OpenGL ES 3.0, OpenCL 1.2, Vulkan) VPU (Videodekodierung: 1080p60, H.265/4, VP9, VP8; Videoenkodierung: 1080p60, H.265/4) 2 × GbE mit TSN, 2 × USB 3.0, 1 × USB OTG, 4 × USB 2.0, 2 × CAN-FD, 4 × UART, 6 × I²C, 2 × I²S, 1 × PCIe 3.0 (1-Lane), 2 × SPI, TPM, 1 × SDIO, 12 × GPIO Weiter Temperaturbereich: -40°C bis 85°C

Yocto Project, Ubuntu, Debian, Android, Linux und RTOS
Vollständiges Board Support Package (BSP) mit sofort einsatzbereiten Images BSP für Yocto Project, Ubuntu, Debian und Android Kontinuierliche BSP-Updates und Wartung

Beschleunigen Sie Ihr Produktdesign
Vollständiges Trägerplatten-Designpaket – Schaltpläne, Stückliste (BOM), PCB-Layout und 3D STEP-Dateien Direkter technischer Support durch Embedian-Designingenieure Kostenlose Designüberprüfung durch Embedian-Ingenieure Trägerplatten-Debugging durch Embedian-Designingenieure Treiberanpassungsservice für kundenspezifische LCD-Panels

Spezifikationen

Specifications
Technical Information
Compliance	SMARC 2.1 Compliant
Dimension (W x L)	82mm x 50mm
CPU	NXP i.MX8M PLUS 4 x Cortex-A53 @1.8GHz Real-time 800MHz ARM Cortex-M7
GPU	GC7000 Ultra Lite (3D) and GC520L (2D) Supports OpenGL ES 3.1/3.0, Vulkan, Open CL 1.2 FP, OpenVG 1.1 and G2D Supports upto 4Kp30 resolutions
VPU	Video Decode: 1080p60, h.265/4, VP9, VP8 Video Encode: 1080p60, h.265/4
NPU	2.3 TOP/s Neural Network performance Keyword detect, noise reduction, beamforming Speech recognition (i.e. Deep Speech 2) Image recognition (i.e. ResNet-50)
Main Memory	32-bit 2GB/4GB/6GB LPDDR4 up to 3200MT/s 16GB eMMC (5.x) onboard AT24C32 EEPROM onboard
Display	HDMI 2.0a (up to 4Kp30) Dual Channel LVDS display (up to 1920x1200@60Hz) MIPI DSI (up to 1920x1440p60)
TPM	Support TPM 2.0
Camera Interface	1 x 2-lane and 1 x 4-lane MIPI-CSI
SDIO	One SDIO interface 1 x 4-bit SDIO card interface with support lines
SPI	Two SPI interfaces with two chip selects per SPI channel.
I2S	Two I2S interfaces Typically used for connection to I2S audio CODECs
PCIe	1 x PCIe Gen 3.0 (1-lane) Common PCIe wake signal
I2C	Six I2C interfaces Power Management General Purpose Camera 0 Camara 1 LCD Display ID HDMI
UART	Four asynchronous serial ports Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#). Two ports supporting data-only signals (RXD, TXD).
FlexCAN Bus	Two CAN-FD interfaces Logic level signals from Module based FlexCAN bus protocol controllers RXD and TXD only
USB	One USB OTG 2.0 Ports with PHY Four USB 2.0 Host with PHY Two USB 3.0 Host with PHY
Gigabit Ethernet	Two GbE MDI interfaces Realtek RTL-8211FD-CG PHY on module No magnetics on Module LED support signals
Real-Time Clock (RTC)	External Seiko S35390A controller on module
General Purpose I/O	12 x GPIO Signals, specific alternate functions are assigned to some GPIOs PWM / Tachometer capability Camera support CAN Error Signaling HD Audio reset
System and Power Management Signals	Reset Out and Reset In Power Button Input Power Source Sataus Module Power State Status System Management Pins Battery and Battery Charger Management Pins Carrier Power On Control Pins
Power Consumption	3.5W (Typical) 5.2W (Max)
Heat Sink	VTT-HS-8J066B1 Note: i.MX8M Plus needs heat sink
Boot Source Select	Three pins to allow selection from carrier board. Select options include to boot from one of the following: Module eMMC Flash (Default) Network Boot Carrier SD Card (Recovery)
Power Supply
3V to 5.25V	Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply 1.8V VDDIO
Temperature
Industrial Temperature Range	-40 degree C ~ 85 degree C
Commercial Temperature Range	0 degree C ~ 60 degree C
Storage Temperature Range	-40 degree C ~ 150 degree C
Junction Temperature Range	-40 degree C ~ 150 degree C
Form Factor
SMARC 2.1	82 mm x 50 mm by SMARC 2.1 Specification

Design-Ressourcen

Software-Handbücher

Yocto Developer's Guide label Comprehensive Yocto developer guide for building, customizing embedded Linux systems Scarthgap Yocto Scarthgap (Kernel 6.6.52) Mickledore Yocto Mickledore (Kernel 6.1.55) Kirkstone Yocto Kirkstone (Kernel 5.15.71) All Release All SMARC-iMX8 Yocto Release	Debian Developer's Guide label Comprehensive Debian developer guide for building, customizing embedded Linux systems Debian 12 Bookworm Debian Bullseye (Kernel 5.10.9) Debian 11 Bullseye Debian Bookworm (Kernel 6.6.52) All Release All Debian Release	Ubuntu Developer's Guide label Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems Ubuntu 22.04 Ubuntu 22.04(Kernel 6.1.55) All Release All Ubuntu Release	Real-Time Edge Developer's Guide label Real-Time Edge Software enables deterministic Linux, industrial networking, low latency applications. RT Edge v3.1 Real-Time Edge v3.1 (Kernel 6.6.36) RT Edge v2.5 Real-Time Edge v2.5 (Kernel 5.15.71)	Android Developer's Guide label Comprehensive Android developer guide for building, customizing embedded Linux systems Android 15 Android 15(Kernel 6.6.58) Android 11 Android 11(Kernel 5.10.9) All Release All Android Release

SMARC-iMX8MP NXP SMARC 2.1 System-on-Module

Konformität mit dem SMARC v2.0+ Modulstandard
SMARC v2.0+ Modul-Bring-up-Plattform für Hardware- und Softwareentwicklung
Evaluierungs- und Validierungsplattform für SMARC 2.0+ Module
Referenzdesign für kundenspezifische Carrier-Boards
Priorisierter technischer Support von Embedian

Ordering Info.
Part Number: EVK-STD-CARRIER-S20

Packing Lists
1 x EVK-STD-CARRIER-S20 carrier board 4 x M2.5 screws 1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules) 1 x LVDS cable 1 x LVDS LCD Backlight cable 1 x 12V/3.5A Power Supply 1 x SATA Power cable 1 x 10-way box header to DB9 cable (for console or RS232) SMARC module not included)

Evaluation Bseboard Features
DC +12V ~ +24V Power input with 2.5mm DC Jack Accept 1.8V VDDIO SMARC 2.0+ compliant module Supports all SMARC 2.0+ I/O interfaces Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

Bestellinformationen

Notes
1.	Q: Quad Core Cortex-A53 D: Dual Core Cortex-A53
2.	2GB: 2GB LPDDR4 memory 4GB: 4GB LPDDR4 memory 6GB: 6GB LPDDR4 memory
3.	I: Industrial Temperature (-40 degree C ~ 85 degree C); Only industrial temperature option for this part.
4.	C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.
Example
Part Number: *SMARC-iMX8MP-Q-2G-I* Description: Quad core Cortex-A53 i.MX8M PLUS processor SMARC 2.1 module with 2GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)
Part Number: *SMARC-iMX8MP-Q-4G* Description: Quad core Cortex-A53 i.MX8M PLUS processor SMARC 2.1 module with 4GB LPDDR4, Commercial Temperature (0 degree C ~ 60 degree C)
Optional Accessaries
Heat Sink
P/N: VTT-HS-8J066B1
Description: Heak sink for SMARC-iMX8MP and SMARC-iMX8

Teilen:

SMARC-iMX8MP NXP SMARC 2.1 System-on-Module

Spezifikationen

Design-Ressourcen

Software-Handbücher

SMARC-iMX8MP NXP SMARC 2.1 System-on-Module

Bestellinformationen

Warum Embedian wählen?

NXP EBS-Partner

TI Direktkonto

Eine Kultur von hoher Qualität und Effizienz

20 Jahre Erfahrung mit ARM-Cortex-Plattformen

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SMARC-iMX8MP

Teilen:

SMARC-iMX8MP NXP SMARC 2.1 System-on-Module

Spezifikationen

Design-Ressourcen

Software-Handbücher

SMARC-iMX8MP NXP SMARC 2.1 System-on-Module

Bestellinformationen

Warum Embedian wählen?

NXP EBS-Partner

TI Direktkonto

Eine Kultur von hoher Qualität und Effizienz

20 Jahre Erfahrung mit ARM-Cortex-Plattformen