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SMARC-FiMX6

Preisspanne: $130 bis $165

  • NXP i.MX6 4/2/1 x Cortex-A9 @1GHz
  • 1GB/2GB/512MB DDR3L, 8GB eMMC
  • HDMI, LVDS, 1x GBE, 1x MIPI-CSI
  • 2x CANs, 4x UARTs, 4x I2C, 1x I2S, 1x PCIe , 2x SPI, 1x USB2.0 OTG, 1x USB 2.0 Host

 

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SKU: SMARC-FiMX6-D-2G-I Category: Tag:

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SMARC-FiMX6 NXP SMARC 1.1/1.0 System-on-Module

  • Quad-/Dual-/Dual-Lite-/Single-Core ARM Cortex-A9, 1,2 GHz (800 MHz für industrielle Temperaturversion)
  • Echtzeit-ARM-Cortex-M4-Koprozessor, 266 MHz
  • SMARC-1.1- (S158 schwebend) und SMARC-1.0- (S158 geerdet) Konformität
  • Abmessungen (B × L): 82 mm × 50 mm
  • Verfügbarkeit garantiert bis 2031

Highlights


2 GB / 1 GB / 512 MB DDR3L und 8 GB eMMC


HDMI, 24-Bit-Dual-Channel-LVDS (1080p) sowie 1 × MIPI-CSI (2 Lanes)


3D-GPU (Vivante GC2000) und 2D-GPU (Vivante GC355 und GC320)


VPU (Videodekodierung: 1080p60 H.264; Videoenkodierung: 1080p30 H.264)


1 × Gigabit-Ethernet, 1 × USB 2.0 OTG, 1 × USB 2.0 Host, 2 × CAN, 4 × UART, 4 × I2C, 2 × I2S, 1 × PCIe 2.0 (1 Lane), 2 × SPI, 1 × SDIO, 12 × GPIO


Industrie-Temperaturbereich: -40 °C bis 85 °C

Yocto Project, Linux und RTOS


Vollständiges Board Support Package (BSP) mit sofort einsatzbereiten Images


Yocto Project BSP


Kontinuierliche BSP-Updates und Wartung

Beschleunigen Sie Ihr Produktdesign


Vollständiges Trägerplatten-Designpaket – Schaltpläne, Stückliste (BOM), PCB-Layout und 3D STEP-Dateien


Direkter technischer Support durch Embedian-Designingenieure


Kostenlose Designüberprüfung durch Embedian-Ingenieure


Trägerplatten-Debugging durch Embedian-Designingenieure


Treiberanpassungsservice für kundenspezifische LCD-Panels

hardware document Technische Spezifikationen

Specifications

Technical Information

Compliance

SMARC 1.1 (S158 grounded) and 1.0 (S158 floating) Compliant

Dimension (W x L)

82mm x 50mm

CPU

  • NXP i.MX6 4/2/1 x Cortex-A9 @1.2GHz (800Mhz for industrial temp.)

GPU

  • Vivante GC2000 (3D, dual and quad core, supports OpenGL ES 3.0, OpenCL and higher performance graphics.)

  • Vivante GC880 (3D, dual lite core and solo core, supports OpenGL ES 2.0 only)

  • Vivante GC355 and GC320 (2D, dual core and solo core)

  • emulated 2D on GPU + Vivante GC320 (2D, dual lite core and solo core)

  • Up to 1080p60 resolutions

VPU

  • Video Decode: 1080p 60 h.264

  • Video Encode: 1080p30 H.264

Main Memory

  • 2GB/1GB(dual lite)/512MB(solo) DDR3L

  • 8GB eMMC (5.x) onboard

  • 4MB SPI NOR Flash

  • AT24C32 EEPROM onboard

Display

  • HDMI 1.4

  • Dual Channel LVDS display

  • Up to 1080p60

Camera Interface

  • 1 x 2-lane MIPI-CSI

SDIO

One SDIO interface

  • 1 x 4-bit SDIO card interface with support lines

SPI

Two SPI interfaces with two chip selects per SPI channel.

I2S

One I2S interfaces

  • Typically used for connection to I2S audio CODECs

I2C

Four I2C interfaces

  • Power Management

  • General Purpose

  • Camera 0

  • LCD Display ID

UART


  • Four asynchronous serial ports

  • Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).

  • Two ports supporting data-only signals (RXD, TXD).

CAN Bus

Two CAN 2.0b interfaces

  • Logic level signals from Module based CAN bus protocol controllers

  • RXD and TXD only

USB

  • One USB OTG 2.0 Ports with PHY

  • One USB 2.0 Host with PHY

PCIe

  • One PCIe 2.0 (1-lane)

  • Common PCIe wake signal

Gigabit Ethernet

  • One GbE MDI interfaces

  • Realtek RTL-8211FD-CG PHY on module

  • No magnetics on Module

  • LED support signals

Real-Time Clock (RTC)

External Seiko S35390A controller on module

General Purpose I/O

12 x GPIO Signals, specific alternate functions are assigned to some GPIOs

  • PWM / Tachometer capability

  • Camera support

  • CAN Error Signaling

  • HD Audio reset

System and Power Management Signals

  • Reset Out and Reset In 

  • Power Button Input

  • Power Source Sataus

  • Module Power State Status

  • System Management Pins

  • Battery and Battery 

  • Charger Management Pins

  • Carrier Power On Control Pins

Power Consumption

  • 1.55W ~ 3.6W (Typical)

Heat Sink

VTT-HS-8J064

  • Note: i.MX6 quad core and dual core need heat sink

Boot Source Select

Three pins to allow selection from carrier board. Select options include to boot from one of the following:

  • Module NOR Flash (Default)

  • Module eMMC Flash

  • Network Boot

  • Carrier SD Card (Recovery)

Power Supply

3V to 5.25V

Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply

  • 1.8V (S158 grounded) or 3.3V (S158 floating) VDDIO 

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

SMARC 1.1 or 1.0

82 mm x 50 mm by SMARC 1.1 and 1.0 Specification

hardware document Design-Ressourcen

 

hardware document Software-Anleitungen

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Android

Developer's Guide

Comprehensive Android developer guide for building, customizing embedded Linux systems

  • Android Nougat (N7.1.2_2.0.0)

    Android Nougat(Kernel 4.9)

  • Android Marshmallow (M6.0.1_2.0.1 BSP)

    Android Marshmallow (Kernel 4.1)

  • All Release

    All Android Release

SMARC-iMX8M NXP SMARC 2.0 System-on-Module

  • Konform mit dem SMARC-v2.0+-Modulstandard
  • SMARC-v2.0+-Modul-Bring-up-Plattform für Hardware- und Softwareentwicklung
  • Evaluierungs- und Validierungsplattform für SMARC-2.0+-Module
  • Referenzdesign für kundenspezifische Carrier-Boards
  • Bevorzugter technischer Support von Embedian

Ordering Info.


Part Number: EVK-STD-CARRIER-S20

Packing Lists


1 x EVK-STD-CARRIER-S20 carrier board


4 x M2.5 screws


1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)


1 x LVDS cable


1 x LVDS LCD Backlight cable


1 x 12V/3.5A Power Supply


1 x SATA Power cable


1 x 10-way box header to DB9 cable (for console or RS232)


SMARC module not included)

Evaluation Bseboard Features


DC +12V ~ +24V Power input with 2.5mm DC Jack


Accept 1.8V VDDIO SMARC 2.0+ compliant module


Supports all SMARC 2.0+ I/O interfaces


Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

hardware document Bestellinformationen

Part Number

Notes

1.

  • Q: Quad Core Cortex-A9

  • D: Dual Core Cortex-A9

  • U: Dual Lite Core Cortex-A9

  • S: Solo Core Cortex-A9

2.

  • 2GB: 2GB DDR3L memory

  • 1GB: 1GB DDR3L memory

  • Leave it blank if solo core (512MB DDR3L)

3.

  • I: Industrial Temperature (-40 degree C ~ 85 degree C); Only industrial temperature option for this part.

4.

  • C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Example

  • Part Number: SMARC-FiMX6-D-2G-I

Description: Dual core Cortex-A9 i.MX6 processor SMARC 1.1/1.0 module with 2GB DDR3L, Industrial Temperature (-40 degree C ~ 85 degree C)

  • Part Number: SMARC-FiMX6-U-1G

Description: Dial Lite core Cortex-A9 i.MX6 processor SMARC 1.1/1.0 module with 1GB DDR3L, Commercial Temperature (0 degree C ~ 60 degree C)

Optional Accessaries

Heat Sink

  • P/N: VTT-HS-8J064

Description: Heak sink for SMARC-FiMX6 (dual and quad core i.MX6 need heat sink)

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