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SMARC-iMX8MM

$135

  • NXP i.MX8M Mini, 4 × Cortex-A53 @ 1,8 GHz
  • 2 GB/4 GB LPDDR4, 16 GB eMMC
  • LVDS, 1 × Gigabit-Ethernet (GbE), 1 × MIPI-CSI
  • 2x CAN, 4x UART, 5x I2C, 2x I2S, 1x PCIe, 2x SPI, 1x USB2.0 OTG und 4x USB2.0

 

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SKU: SMARC-iMX8MM-6-2G Category: Tag:

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SMARC-iMX8MM NXP SMARC 2.0 System-on-Module

  • Quad- / Dual-Core ARM Cortex-A53, 1,8 GHz
  • Echtzeit-ARM-Cortex-M4-Koprozessor, 400 MHz
  • SMARC-2.0-konform (82 mm × 50 mm)
  • Verfügbarkeit garantiert bis 2038

Funktions-Highlights


2 GB oder 4 GB LPDDR4 sowie 16 GB eMMC


24-Bit-Dual-Channel-LVDS (1080p) und 1 × MIPI-CSI (4-LANE)


GPU (OpenGL ES 2.0, OpenVG 1.1 und G2D)


VPU (1080p60 VP9 / H.265 / H.264 / VP8 Dekodierung; 1080p60 H.264 / VP8 Kodierung)


1 × GbE mit AVB, 1 × USB OTG, 4 × USB 2.0, 2 × CAN, 4 × UART, 4 × I2C, 2 × I2S, 1 × PCIe 2.0 (1-Lane), 2 × SPI, 1 × SDIO, 12 × GPIO


Weiter Temperaturbereich: -40 °C bis 85 °C

Yocto Project, Debian, Android, Linux und RTOS


Vollständiges Board Support Package (BSP) mit sofort einsatzbereiten Images


Yocto Project, Debian und Android BSP


Mises à jour et maintenance continues du BSP

Beschleunigen Sie Ihr Produktdesign


Vollständiges Trägerplatten-Designpaket – Schaltpläne, Stückliste (BOM), PCB-Layout und 3D STEP-Dateien


Direkter technischer Support durch Embedian-Designingenieure


Kostenlose Designüberprüfung durch Embedian-Ingenieure


Trägerplatten-Debugging durch Embedian-Designingenieure


Treiberanpassungsservice für kundenspezifische LCD-Panels

hardware document Technische Daten

Specifications

Technical Information

Compliance

SMARC 2.0 Compliant

Dimension (W x L)

82mm x 50mm

CPU

  • NXP i.MX8M Mini 4/2 x Cortex-A53 @1.8GHz

  • Real-time 400MHz ARM Cortex-M4

GPU

  • GCNanoUltra (3D) and GC320 (2D)

  • OpenGL ES 2.0, OpenVG 1.1 and G2D

  • Up to 1080p60 resolutions

VPU

  • 1080p60 VP9/VP8/H.265/H.264 decoder

  • 1080p60 H.264/VP8 encoder

Main Memory

  • 32-bit 2GB/4GB LPDDR4 up to 3200MT/s

  • 16GB eMMC (5.x) onboard

  • AT24C32 EEPROM onboard

Display

  • Dual Channel LVDS display (up to 1920x1200@60Hz, interface vis MIPI-DSI by TI SN65DSI84 bridge)

Camera Interface

  •  1 x 4-lane MIPI-CSI

SDIO

One SDIO interface

  • 1 x 4-bit SDIO card interface with support lines

SPI

Two SPI interfaces with two chip selects per SPI channel.

I2S

Two I2S interfaces

  • Typically used for connection to I2S audio CODECs

I2C

Four I2C interfaces

  • Power Management

  • General Purpose

  • Camera 0

  • LCD Display ID

UART


  • Four asynchronous serial ports

  • Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).

  • Two ports supporting data-only signals (RXD, TXD).

CAN Bus

Two CAN 2.0b interfaces (via Microchip MCP2515 SPI to CAN bridge)

  • Logic level signals from Module based CAN bus protocol controllers

  • RXD and TXD only

  • Maxmium baud rate at 250k without package loss.

USB

  • One USB OTG 2.0 Ports with PHY

  • Four USB 2.0 Host with PHY

PCIe

  • One PCIe 2.0 (1-lane)

  • Common PCIe wake signal

Gigabit Ethernet

  • One GbE MDI interfaces

  • Realtek RTL-8211FD-CG PHY on module

  • No magnetics on Module

  • LED support signals

Real-Time Clock (RTC)

External Seiko S35390A controller on module

General Purpose I/O

12 x GPIO Signals, specific alternate functions are assigned to some GPIOs

  • PWM / Tachometer capability

  • Camera support

  • CAN Error Signaling

  • HD Audio reset

System and Power Management Signals

  • Reset Out and Reset In 

  • Power Button Input

  • Power Source Sataus

  • Module Power State Status

  • System Management Pins

  • Battery and Battery 

  • Charger Management Pins

  • Carrier Power On Control Pins

Power Consumption

  • 1.6W (Typical)

  • 2.1W (Max)

Boot Source Select

Three pins to allow selection from carrier board. Select options include to boot from one of the following:

  • Module eMMC Flash (Default)

  • Network Boot

  • Carrier SD Card (Recovery)

Power Supply

3V to 5.25V

Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply

  • 1.8V VDDIO

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

SMARC 2.0

82 mm x 50 mm by SMARC 2.0 Specification

hardware document Designressourcen

 

hardware document Software-Handbücher

Yocto

Developer's Guide

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Debian

Developer's Guide

Comprehensive Debian developer guide for building, customizing embedded Linux systems

Android

Developer's Guide

Comprehensive Android developer guide for building, customizing embedded Linux systems

SMARC-iMX8M NXP SMARC 2.0 System-on-Module

  • Konform mit dem SMARC-v2.0+-Modulstandard
  • SMARC-v2.0+-Modul-Bring-up-Plattform für Hardware- und Softwareentwicklung
  • Evaluierungs- und Validierungsplattform für SMARC-2.0+-Module
  • Referenzdesign für kundenspezifische Carrier-Boards
  • Bevorzugter technischer Support von Embedian

Ordering Info.


Part Number: EVK-STD-CARRIER-S20

Packing Lists


1 x EVK-STD-CARRIER-S20 carrier board


4 x M2.5 screws


1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)


1 x LVDS cable


1 x LVDS LCD Backlight cable


1 x 12V/3.5A Power Supply


1 x SATA Power cable


1 x 10-way box header to DB9 cable (for console or RS232)


SMARC module not included)

Evaluation Bseboard Features


DC +12V ~ +24V Power input with 2.5mm DC Jack


Accept 1.8V VDDIO SMARC 2.0+ compliant module


Supports all SMARC 2.0+ I/O interfaces


Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

Hardware-Dokument Bestellinformationen

Artikelnummer

Notes

1.

  • 6: Quad Core Cortex-A53

  • 5: Quad Lite Core Cortex-A53 (No VPU)

2.

  • 2GB: 2GB LPDDR4 memory

  • 4GB: 4GB LPDDR4 memory (only quad core support 4GB)

3.

  • I: Industrial Temperature (-40 degree C ~ 85 degree C); Only industrial temperature option for this part.

4.

  • C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Example

  • Part Number: SMARC-iMX8MM-6-4G-I

Description: Quad core Cortex-A53 i.MX8M Mini processor SMARC 2.0 module with 4GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)

  • Part Number: SMARC-iMX8MM-5-2G

Description: Quad core Cortex-A53 i.MX8M Mini processor SMARC 2.0 module with 2GB LPDDR4, Commercial Temperature (0 degree C ~ 60 degree C)

Optional Accessaries

Heat Sink

  • P/N: VTT-HS-8J066B2

Description: Heak sink for SMARC-iMX8MM

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