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SMARC-iMX8MQ

$165


  • NXP i.MX8M 4 x Cortex-A53 @1,5 GHz
  • 2 GB/4 GB LPDDR4, 16 GB eMMC
  • HDMI/DP, LVDS, 1x GBE, 2x MIPI-CSI
  • 2x CAN, 4x UART, 5x I2C, 2x I2S, 2x PCIe, 2x SPI, 2x USB3.0, 1x USB2.0 OTG und 4x USB2.0

 

or
SKU: SMARC-iMX8M-Q-2G Categories: Tag:

Teilen:

SMARC-iMX8M NXP SMARC 2.0 System-on-Module


  • Quad- / Dual-Core ARM Cortex-A53, 1,5 GHz
  • Echtzeit-ARM-Cortex-M4-Koprozessor, 266 MHz
  • SMARC-2.0-konform (82 mm × 50 mm)
  • Verfügbarkeit garantiert bis 2038

Funktions-Highlights


2 GB oder 4 GB LPDDR4 sowie 16 GB eMMC


HDMI-2.0a-/DP-Anschluss mit einer Auflösung bis zu 4Kp60, 24-Bit-Dual-Channel-LVDS (1080p) und 2 × MIPI-CSI (2-LANE und 4-LANE)


GPU (OpenGL ES 3.1, OpenCL 1.2, OpenGL 3.0, OpenVG und Vulkan)


VPU (4Kp60 (H.265, VP9), 4Kp30 (H.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, H.263, DivX), MJPEG)


1 × GbE mit AVB, 2 × USB 3.0, 1 × USB OTG, 4 × USB 2.0, 2 × CAN, 4 × UART, 5 × I2C, 2 × I2S, 2 × PCIe 2.1 (1-Lane), 2 × SPI, 1 × SDIO, 12 × GPIO


Weiter Temperaturbereich: -40 °C bis 85 °C


Yocto Project, Ubuntu, Debian, Android, Linux und RTOS


Vollständiges Board Support Package (BSP) mit sofort einsatzbereiten Images


BSP für Yocto Project, Ubuntu, Debian und Android


Kontinuierliche BSP-Updates und Wartung


Beschleunigen Sie Ihr Produktdesign


Vollständiges Trägerplatten-Designpaket – Schaltpläne, Stückliste (BOM), PCB-Layout und 3D-STEP-Datei des SMARC-Moduls


Direkter technischer Support durch Embedian-Designingenieure


Kostenlose Designüberprüfung durch Embedian-Ingenieure


Trägerplatten-Debugging durch Embedian-Designingenieure


Treiberanpassungsservice für kundenspezifische LCD-Panels

hardware document Technische Daten

Specifications


Technical Information

Compliance

SMARC 2.0 Compliant

Dimension (W x L)

82mm x 50mm

CPU

  • NXP i.MX8M 4/2 x Cortex-A53 @1.5GHz

  • Real-time 266MHz ARM Cortex-M4

GPU

  • GC7000 Lite (3D)

  • OpenGL ES 3.1, OpenGL 3.0, Vulkan, Open CL 1.2

  • Up to 4Kp60 resolutions

VPU

  • Video Decode: 4Kp60 (h.265, VP9), 4Kp30 (h.264), 1080p60 (MPEG2, MPEG4p2, VC1, VP8, RV9, AVS/AVS+, h.263, DiVX), MJPEG

Main Memory

  • 32-bit 2GB/4GB LPDDR4 up to 3200MT/s

  • 16GB eMMC (5.x) onboard

  • AT24C32 EEPROM onboard

Display

  • HDMI 2.0a (up to 4Kp30)

  • Dual Channel LVDS display (up to 1920x1200@60Hz, interface vis MIPI-DSI by TI SN65DSI84 bridge)

Camera Interface

  • 1 x 2-lane and 1 x 4-lane MIPI-CSI

SDIO

One SDIO interface

  • 1 x 4-bit SDIO card interface with support lines

SPI

Two SPI interfaces with two chip selects per SPI channel.

I2S

Two I2S interfaces

  • Typically used for connection to I2S audio CODECs

I2C

Six I2C interfaces

  • Power Management

  • General Purpose

  • Camera 0

  • Camara 1

  • LCD Display ID

  • HDMI

UART


  • Four asynchronous serial ports

  • Two ports supporting four-wire handshaking (RXD, TXD, RTS#, CTS#).

  • Two ports supporting data-only signals (RXD, TXD).

CAN Bus

Two CAN 2.0b interfaces (via Microchip MCP2515 SPI to CAN bridge)

  • Logic level signals from Module based CAN bus protocol controllers

  • RXD and TXD only

  • Maxmium baud rate at 250k without package loss.

USB

  • One USB OTG 2.0 Ports with PHY

  • Four USB 2.0 Host with PHY

  • Two USB 3.0 Host with PHY

PCIe

  • Two PCIe 2.1 (1-lane)

  • Common PCIe wake signal

Gigabit Ethernet

  • One GbE MDI interfaces

  • Realtek RTL-8211FD-CG PHY on module

  • No magnetics on Module

  • LED support signals

Real-Time Clock (RTC)

External Seiko S35390A controller on module

General Purpose I/O

12 x GPIO Signals, specific alternate functions are assigned to some GPIOs

  • PWM / Tachometer capability

  • Camera support

  • CAN Error Signaling

  • HD Audio reset

System and Power Management Signals

  • Reset Out and Reset In 

  • Power Button Input

  • Power Source Sataus

  • Module Power State Status

  • System Management Pins

  • Battery and Battery 

  • Charger Management Pins

  • Carrier Power On Control Pins

Power Consumption

  • 3.6W (Typical)

  • 5.3W (Max)

Heat Sink

VTT-HS-8J066

  • Note: i.MX8MQ needs heat sink

Boot Source Select

Three pins to allow selection from carrier board. Select options include to boot from one of the following:

  • Module eMMC Flash (Default)

  • Network Boot

  • Carrier SD Card (Recovery)

Power Supply

3V to 5.25V

Operates directly from single level Lithium Ion cells, or fixed 3.3V or 5V power supply

  • 1.8V VDDIO

Temperature

Industrial Temperature Range

-40 degree C ~ 85 degree C

Commercial Temperature Range

0 degree C ~ 60 degree C

Storage Temperature Range

-40 degree C ~ 150 degree C

Junction Temperature Range

-40 degree C ~ 150 degree C

Form Factor

SMARC 2.0

82 mm x 50 mm by SMARC 2.0 Specification

hardware document Design-Ressourcen

 

hardware document Software-Handbücher

Yocto

Developer's Guide

;

Comprehensive Yocto developer guide for building, customizing embedded Linux systems

Debian

Developer's Guide

;

Comprehensive Debian developer guide for building, customizing embedded Linux systems

Ubuntu

Developer's Guide

;

Comprehensive Ubuntu developer guide for building, customizing embedded Linux systems

Android

Developer's Guide

;

Comprehensive Android developer guide for building, customizing embedded Linux systems

SMARC-iMX8M NXP SMARC 2.0 System-on-Module


  • Konform mit dem SMARC-v2.0+-Modulstandard
  • SMARC-v2.0+-Modul-Bring-up-Plattform für Hardware- und Softwareentwicklung
  • Evaluierungs- und Validierungsplattform für SMARC-2.0+-Module
  • Referenzdesign für kundenspezifische Carrier-Boards
  • Bevorzugter technischer Support von Embedian

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Packing Lists


1 x EVK-STD-CARRIER-S20 carrier board


4 x M2.5 screws


1 x bootable SDHC card with image pre-installed (only when purchase together with Embedian SMARC modules)


1 x LVDS cable


1 x LVDS LCD Backlight cable


1 x 12V/3.5A Power Supply


1 x SATA Power cable


1 x 10-way box header to DB9 cable (for console or RS232)


SMARC module not included)


Evaluation Bseboard Features


DC +12V ~ +24V Power input with 2.5mm DC Jack


Accept 1.8V VDDIO SMARC 2.0+ compliant module


Supports all SMARC 2.0+ I/O interfaces


Form factor: 170mm (L) x 170mm (W) (mini-ITX form factor)

Hardware-Dokument Bestellinformationen

Teilenummer

Notes

1


Q: Quad Core Cortex-A53


L: Quad Core Cortex-A53 (no VPU)


D: Dual Core Cortex-A53

2


2G: 2GB LPDDR4


4G: 4GB LPDDR4

3. I: Industrial Temperature (-40 degree C ~ 85 degree C); Leave it blank if commercial temperature.

4. C: Conforrmal Coating (Only support it for industrial temperature variants and at the mass production stage); Leave it blank if not needed.

Examples


Part Number: SMARC-iMX8M-Q-4G-I

Description: Quad core Cortex-A53 i.MX8M processor SMARC 2.0 module with 4GB LPDDR4, Industrial Temperature (-40 degree C ~ 85 degree C)


Part Number: SMARC-iMX8M-Q-2G

Description: Quad core Cortex-A53 i.MX8M processor SMARC 2.0 module with 2GB LPDDR4, Commercial Temperature (0 degree C ~ 60 degree C)

Optional Accessories

P/N: VTT-HS-8J066

Heat Sink


Description: Heak sink for SMARC-iMX8M

Packing List


1 x SMARC-iMX8M Module

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